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Manufacturer / Brand: Texas Instruments
Details: Enhanced Product Low-Power Applications Processor 361-NFBGA -55 to 125
HTS Code: 8542.31.00.01
Quantity Available: Over 111460 Pieces

Datasheet for OMAPL138BGWTMEP:

OMAPL138BGWTMEP datasheet
Price for OMAPL138BGWTMEP
Product Parameters
  • Manufacturer Part Number : OMAPL138BGWTMEP
  • Manufacturer : Texas Instruments
  • Description : Enhanced Product Low-Power Applications Processor 361-NFBGA -55 to 125
  • Reference Price : USD 58.53
  • Our Price : We have a better price, contact us by email
  • Function : -
  • CPU Family: -
  • RAM Type: -
  • Status : Active (In Production)
  • ROHS Status : Rohs Compliant
  • Package Type : -
  • Standard Packing Type : Reel / Tube / Tray / Box
  • Standard Packing Quantity : -
  • Working Temperature : -
  • Other Part Number : OMAPL138BGWTMEP
  • Shipping methods : DHL FEDEX UPS TNT
  • Delivery Time : Ship within 1 day.
  • Manufacturer Production time : 6-8 weeks (Normally have stocks)
  • Weight : 0.001KG

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Detailed Description of OMAPL138BGWTMEP
  • Manufacturer Part Number: OMAPL138BGWTMEP
  • Brand Name: Texas Instruments
  • Part Life Cycle Code: Active
  • Ihs Manufacturer: TEXAS INSTRUMENTS INC
  • Part Package Code: BGA
  • Package Description: 16 X 16 MM, 0.80 MM PITCH, PLASTIC, NFBGA-361
  • Pin Count: 361
  • Reach Compliance Code: not_compliant
  • ECCN Code: 3A001.A.2.C
  • HTS Code: 8542.31.00.01
  • Manufacturer: Texas Instruments
  • Risk Rank: 1.53
  • Address Bus Width: 23
  • Barrel Shifter: NO
  • Boundary Scan: YES
  • Clock Frequency-Max: 30 MHz
  • External Data Bus Width: 16
  • Format: FLOATING POINT
  • Integrated Cache: YES
  • Internal Bus Architecture: SINGLE
  • JESD-30 Code: S-PBGA-B361
  • JESD-609 Code: e0
  • Length: 16 mm
  • Low Power Mode: YES
  • Moisture Sensitivity Level: 3
  • Number of DMA Channels: 80
  • Number of Terminals: 361
  • Number of Timers: 8
  • On Chip Data RAM Width: 8
  • On Chip Program ROM Width: 8
  • Operating Temperature-Max: 125 °C
  • Operating Temperature-Min: -55 °C
  • Package Body Material: PLASTIC/EPOXY
  • Package Code: LFBGA
  • Package Equivalence Code: BGA361,19X19,32
  • Package Shape: SQUARE
  • Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH
  • Peak Reflow Temperature (Cel): 220
  • Power Supplies: 1.2,1.8/3.3 V
  • RAM (words): 8192
  • ROM Programmability: MROM
  • Seated Height-Max: 1.4 mm
  • Subcategory: Other Microprocessor ICs
  • Supply Voltage-Max: 1.32 V
  • Supply Voltage-Min: 1.14 V
  • Supply Voltage-Nom: 1.2 V
  • Surface Mount: YES
  • Technology: CMOS
  • Temperature Grade: MILITARY
  • Terminal Finish: Tin/Lead (Sn/Pb)
  • Terminal Form: BALL
  • Terminal Pitch: 0.8 mm
  • Terminal Position: BOTTOM
  • Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
  • Width: 16 mm
  • uPs/uCs/Peripheral ICs Type: DIGITAL SIGNAL PROCESSOR, OTHER
  • OMAPL138BGWTMEP CAD Models Information
    • Part Symbol photo
    • Footprint
    • 3D Model
    FAQ (Frequently Asked Questions) for OMAPL138BGWTMEP
    • Q:Where can I buy OMAPL138BGWTMEP?

      A:We have the OMAPL138BGWTMEP available for sell at the moment, you can contact us by email for the price and delivery time.

    • Q:How do I place an order and pay it?

      A:You can place an order by email, and you can pay by Bank Transfer or Paypal.

    • Q:How long I can receive the shipment after order?

      A:We will ship within 1 day after order, and you will receive it in around 2-3 days.

    • Q:When can I receive a reply after sending email?

      A:We will reply you within 24 hours.

    • Q:How do I use OMAPL138BGWTMEP for my products?

      A:Please refer to the application note.

    • Q:How can I download a datasheet for OMAPL138BGWTMEP?

      A:You can download the datasheet on our product page, or you can send us by email to request a datasheet.

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