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Manufacturer / Brand: Texas Instruments
Details: Enhanced Product Low-Power Applications Processor 361-NFBGA -55 to 125
HTS Code: 8542.31.00.01
Quantity Available: Over 111460 Pieces
Datasheet for OMAPL138BGWTMEP:
Product Parameters
- Manufacturer Part Number : OMAPL138BGWTMEP
- Manufacturer : Texas Instruments
- Description : Enhanced Product Low-Power Applications Processor 361-NFBGA -55 to 125
- Reference Price : USD 58.53
- Our Price : We have a better price, contact us by email
- Function : -
- CPU Family: -
- RAM Type: -
- Status : Active (In Production)
- ROHS Status : Rohs Compliant
- Package Type : -
- Standard Packing Type : Reel / Tube / Tray / Box
- Standard Packing Quantity : -
- Working Temperature : -
- Other Part Number : OMAPL138BGWTMEP
- Shipping methods : DHL FEDEX UPS TNT
- Delivery Time : Ship within 1 day.
- Manufacturer Production time : 6-8 weeks (Normally have stocks)
- Weight : 0.001KG
Contact us to check the best price and real time inventory quantity for OMAPL138BGWTMEP. If you need any more information about OMAPL138BGWTMEP, you can also send us by email. Our email is [email protected], we will reply you in 12 hours.
Related Microcontroller IC
Detailed Description of OMAPL138BGWTMEP
Manufacturer Part Number: OMAPL138BGWTMEPBrand Name: Texas InstrumentsPart Life Cycle Code: ActiveIhs Manufacturer: TEXAS INSTRUMENTS INCPart Package Code: BGAPackage Description: 16 X 16 MM, 0.80 MM PITCH, PLASTIC, NFBGA-361Pin Count: 361Reach Compliance Code: not_compliantECCN Code: 3A001.A.2.CHTS Code: 8542.31.00.01Manufacturer: Texas InstrumentsRisk Rank: 1.53Address Bus Width: 23Barrel Shifter: NOBoundary Scan: YESClock Frequency-Max: 30 MHzExternal Data Bus Width: 16Format: FLOATING POINTIntegrated Cache: YESInternal Bus Architecture: SINGLEJESD-30 Code: S-PBGA-B361JESD-609 Code: e0Length: 16 mmLow Power Mode: YESMoisture Sensitivity Level: 3Number of DMA Channels: 80Number of Terminals: 361Number of Timers: 8On Chip Data RAM Width: 8On Chip Program ROM Width: 8Operating Temperature-Max: 125 °COperating Temperature-Min: -55 °CPackage Body Material: PLASTIC/EPOXYPackage Code: LFBGAPackage Equivalence Code: BGA361,19X19,32Package Shape: SQUAREPackage Style: GRID ARRAY, LOW PROFILE, FINE PITCHPeak Reflow Temperature (Cel): 220Power Supplies: 1.2,1.8/3.3 VRAM (words): 8192ROM Programmability: MROMSeated Height-Max: 1.4 mmSubcategory: Other Microprocessor ICsSupply Voltage-Max: 1.32 VSupply Voltage-Min: 1.14 VSupply Voltage-Nom: 1.2 VSurface Mount: YESTechnology: CMOSTemperature Grade: MILITARYTerminal Finish: Tin/Lead (Sn/Pb)Terminal Form: BALLTerminal Pitch: 0.8 mmTerminal Position: BOTTOMTime@Peak Reflow Temperature-Max (s): NOT SPECIFIEDWidth: 16 mmuPs/uCs/Peripheral ICs Type: DIGITAL SIGNAL PROCESSOR, OTHER
OMAPL138BGWTMEP CAD Models Information
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FAQ (Frequently Asked Questions) for OMAPL138BGWTMEP
Q:Where can I buy OMAPL138BGWTMEP?
A:We have the OMAPL138BGWTMEP available for sell at the moment, you can contact us by email for the price and delivery time.
Q:How do I place an order and pay it?
A:You can place an order by email, and you can pay by Bank Transfer or Paypal.
Q:How long I can receive the shipment after order?
A:We will ship within 1 day after order, and you will receive it in around 2-3 days.
Q:When can I receive a reply after sending email?
A:We will reply you within 24 hours.
Q:How do I use OMAPL138BGWTMEP for my products?
A:Please refer to the application note.
Q:How can I download a datasheet for OMAPL138BGWTMEP?
A:You can download the datasheet on our product page, or you can send us by email to request a datasheet.
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