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Manufacturer / Brand: Texas Instruments
Details: Enhanced product C6455 DSP 697-FCBGA 0 to 90
HTS Code: 8542.31.00.01
Quantity Available: Over 74270 Pieces
Datasheet for SM320C6455BGTZEP:
Product Parameters
- Manufacturer Part Number : SM320C6455BGTZEP
- Manufacturer : Texas Instruments
- Description : Enhanced product C6455 DSP 697-FCBGA 0 to 90
- Reference Price : USD 283.48
- Our Price : We have a better price, contact us by email
- Function : -
- CPU Family: -
- RAM Type: -
- Status : Active (In Production)
- ROHS Status : Rohs Compliant
- Package Type : -
- Standard Packing Type : Reel / Tube / Tray / Box
- Standard Packing Quantity : -
- Working Temperature : -
- Other Part Number : SM320C6455BGTZEP
- Shipping methods : DHL FEDEX UPS TNT
- Delivery Time : Ship within 1 day.
- Manufacturer Production time : 6-8 weeks (Normally have stocks)
- Weight : 0.001KG
Contact us to check the best price and real time inventory quantity for SM320C6455BGTZEP. If you need any more information about SM320C6455BGTZEP, you can also send us by email. Our email is [email protected], we will reply you in 12 hours.
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Detailed Description of SM320C6455BGTZEP
Manufacturer Part Number: SM320C6455BGTZEPBrand Name: Texas InstrumentsPart Life Cycle Code: ActiveIhs Manufacturer: TEXAS INSTRUMENTS INCPart Package Code: BGAPackage Description: 24 X 24 MM, 0.80 MM PITCH, PLASTIC, FCBGA-697Pin Count: 697Reach Compliance Code: not_compliantECCN Code: 3A991.A.2HTS Code: 8542.31.00.01Factory Lead Time: 1 WeekManufacturer: Texas InstrumentsRisk Rank: 1.4Additional Feature: IT ALSO REQUIRES 3.3V I/O SUPPLYAddress Bus Width: 20Barrel Shifter: NOBit Size: 32Boundary Scan: YESClock Frequency-Max: 66.6 MHzExternal Data Bus Width: 64Format: FIXED POINTIntegrated Cache: YESInternal Bus Architecture: MULTIPLEJESD-30 Code: S-PBGA-B697JESD-609 Code: e0Length: 24 mmLow Power Mode: YESMoisture Sensitivity Level: 4Number of DMA Channels: 64Number of Terminals: 697Number of Timers: 4On Chip Program ROM Width: 8Operating Temperature-Max: 90 °CPackage Body Material: PLASTIC/EPOXYPackage Code: HFBGAPackage Equivalence Code: BGA697,29X29,32Package Shape: SQUAREPackage Style: GRID ARRAY, HEAT SINK/SLUG, FINE PITCHPeak Reflow Temperature (Cel): 220Power Supplies: 1.2,1.8,3.3 VQualification Status: Not QualifiedRAM (words): 32768ROM Programmability: MROMSeated Height-Max: 3.1 mmSubcategory: Digital Signal ProcessorsSupply Voltage-Max: 1.2875 VSupply Voltage-Min: 1.2125 VSupply Voltage-Nom: 1.25 VSurface Mount: YESTechnology: CMOSTemperature Grade: OTHERTerminal Finish: Tin/Lead (Sn/Pb)Terminal Form: BALLTerminal Pitch: 0.8 mmTerminal Position: BOTTOMTime@Peak Reflow Temperature-Max (s): NOT SPECIFIEDWidth: 24 mmuPs/uCs/Peripheral ICs Type: DIGITAL SIGNAL PROCESSOR, OTHER
SM320C6455BGTZEP CAD Models Information
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FAQ (Frequently Asked Questions) for SM320C6455BGTZEP
Q:Where can I buy SM320C6455BGTZEP?
A:We have the SM320C6455BGTZEP available for sell at the moment, you can contact us by email for the price and delivery time.
Q:How do I place an order and pay it?
A:You can place an order by email, and you can pay by Bank Transfer or Paypal.
Q:How long I can receive the shipment after order?
A:We will ship within 1 day after order, and you will receive it in around 2-3 days.
Q:When can I receive a reply after sending email?
A:We will reply you within 24 hours.
Q:How do I use SM320C6455BGTZEP for my products?
A:Please refer to the application note.
Q:How can I download a datasheet for SM320C6455BGTZEP?
A:You can download the datasheet on our product page, or you can send us by email to request a datasheet.
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