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Manufacturer / Brand: Texas Instruments
Details: Enhanced product C6415 DSP 532-FCBGA -55 to 105
HTS Code: 8542.31.00.01
Quantity Available: Over 149200 Pieces
Datasheet for SM32C6415EGLZ50SEP:
Product Parameters
- Manufacturer Part Number : SM32C6415EGLZ50SEP
- Manufacturer : Texas Instruments
- Description : Enhanced product C6415 DSP 532-FCBGA -55 to 105
- Reference Price : USD 195.44
- Our Price : We have a better price, contact us by email
- Function : -
- CPU Family: -
- RAM Type: -
- Status : Active (In Production)
- ROHS Status : Rohs Compliant
- Package Type : -
- Standard Packing Type : Reel / Tube / Tray / Box
- Standard Packing Quantity : -
- Working Temperature : -
- Other Part Number : SM32C6415EGLZ50SEP
- Shipping methods : DHL FEDEX UPS TNT
- Delivery Time : Ship within 1 day.
- Manufacturer Production time : 6-8 weeks (Normally have stocks)
- Weight : 0.001KG
Contact us to check the best price and real time inventory quantity for SM32C6415EGLZ50SEP. If you need any more information about SM32C6415EGLZ50SEP, you can also send us by email. Our email is [email protected], we will reply you in 12 hours.
Related Microcontroller IC
Detailed Description of SM32C6415EGLZ50SEP
Manufacturer Part Number: SM32C6415EGLZ50SEPBrand Name: Texas InstrumentsPart Life Cycle Code: ActiveIhs Manufacturer: TEXAS INSTRUMENTS INCPart Package Code: BGAPackage Description: BGA-532Pin Count: 532Reach Compliance Code: not_compliantECCN Code: 3A991.A.2HTS Code: 8542.31.00.01Factory Lead Time: 6 WeeksManufacturer: Texas InstrumentsRisk Rank: 1.46Additional Feature: ALSO REQUIRES 3.3V SUPPLYAddress Bus Width: 23Barrel Shifter: NOBit Size: 32Boundary Scan: YESClock Frequency-Max: 33 MHzExternal Data Bus Width: 64Format: FIXED POINTIntegrated Cache: YESInternal Bus Architecture: MULTIPLEJESD-30 Code: S-PBGA-B532JESD-609 Code: e0Length: 23 mmLow Power Mode: YESMoisture Sensitivity Level: 4Number of DMA Channels: 64Number of External Interrupts: 4Number of Terminals: 532Number of Timers: 3Operating Temperature-Max: 105 °COperating Temperature-Min: -55 °CPackage Body Material: PLASTIC/EPOXYPackage Code: HFBGAPackage Equivalence Code: BGA532,26X26,32Package Shape: SQUAREPackage Style: GRID ARRAY, HEAT SINK/SLUG, FINE PITCHPeak Reflow Temperature (Cel): 220Power Supplies: 1.2,3.3 VQualification Status: Not QualifiedRAM (words): 16384Seated Height-Max: 3.25 mmSubcategory: Digital Signal ProcessorsSupply Voltage-Max: 1.31 VSupply Voltage-Min: 1.19 VSupply Voltage-Nom: 1.25 VSurface Mount: YESTechnology: CMOSTemperature Grade: OTHERTerminal Finish: Tin/Lead (Sn/Pb)Terminal Form: BALLTerminal Pitch: 0.8 mmTerminal Position: BOTTOMTime@Peak Reflow Temperature-Max (s): NOT SPECIFIEDWidth: 23 mmuPs/uCs/Peripheral ICs Type: DIGITAL SIGNAL PROCESSOR, OTHER
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FAQ (Frequently Asked Questions) for SM32C6415EGLZ50SEP
Q:Where can I buy SM32C6415EGLZ50SEP?
A:We have the SM32C6415EGLZ50SEP available for sell at the moment, you can contact us by email for the price and delivery time.
Q:How do I place an order and pay it?
A:You can place an order by email, and you can pay by Bank Transfer or Paypal.
Q:How long I can receive the shipment after order?
A:We will ship within 1 day after order, and you will receive it in around 2-3 days.
Q:When can I receive a reply after sending email?
A:We will reply you within 24 hours.
Q:How do I use SM32C6415EGLZ50SEP for my products?
A:Please refer to the application note.
Q:How can I download a datasheet for SM32C6415EGLZ50SEP?
A:You can download the datasheet on our product page, or you can send us by email to request a datasheet.
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