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Manufacturer / Brand: Texas Instruments
Details: IC 16-BIT, 312.5 MHz, MIXED DSP, PBGA900, 25 X 25 MM, LEAD FREE, PLASTIC, BGA-900, Digital Signal Processor
HTS Code: 8542.31.00.01
Quantity Available: Over 144380 Pieces

Datasheet for TMS320TCI6614XCMS:

TMS320TCI6614XCMS datasheet
Price for TMS320TCI6614XCMS
Product Parameters
  • Manufacturer Part Number : TMS320TCI6614XCMS
  • Manufacturer : Texas Instruments
  • Description : IC 16-BIT, 312.5 MHz, MIXED DSP, PBGA900, 25 X 25 MM, LEAD FREE, PLASTIC, BGA-900, Digital Signal Processor
  • Reference Price : USD 
  • Our Price : We have a better price, contact us by email
  • Function : -
  • CPU Family: -
  • RAM Type: -
  • Status : Active (In Production)
  • ROHS Status : Rohs Compliant
  • Package Type : -
  • Standard Packing Type : Reel / Tube / Tray / Box
  • Standard Packing Quantity : -
  • Working Temperature : -
  • Other Part Number : TMS320TCI6614XCMS
  • Shipping methods : DHL FEDEX UPS TNT
  • Delivery Time : Ship within 1 day.
  • Manufacturer Production time : 6-8 weeks (Normally have stocks)
  • Weight : 0.001KG

Contact us to check the best price and real time inventory quantity for TMS320TCI6614XCMS. If you need any more information about TMS320TCI6614XCMS, you can also send us by email. Our email is [email protected], we will reply you in 12 hours.

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Detailed Description of TMS320TCI6614XCMS
  • Manufacturer Part Number: TMS320TCI6614XCMS
  • Part Life Cycle Code: Obsolete
  • Ihs Manufacturer: TEXAS INSTRUMENTS INC
  • Part Package Code: BGA
  • Package Description: 25 X 25 MM, LEAD FREE, PLASTIC, BGA-900
  • Pin Count: 900
  • Reach Compliance Code: unknown
  • ECCN Code: 3A001.A.3
  • HTS Code: 8542.31.00.01
  • Manufacturer: Texas Instruments
  • Risk Rank: 5.82
  • Address Bus Width: 24
  • Barrel Shifter: NO
  • Boundary Scan: YES
  • Clock Frequency-Max: 312.5 MHz
  • External Data Bus Width: 16
  • Format: FLOATING POINT
  • Internal Bus Architecture: MULTIPLE
  • JESD-30 Code: S-PBGA-B900
  • Length: 25 mm
  • Low Power Mode: YES
  • Number of Terminals: 900
  • Package Body Material: PLASTIC/EPOXY
  • Package Code: FBGA
  • Package Shape: SQUARE
  • Package Style: GRID ARRAY, FINE PITCH
  • Seated Height-Max: 3.39 mm
  • Surface Mount: YES
  • Technology: CMOS
  • Terminal Form: BALL
  • Terminal Pitch: 0.8 mm
  • Terminal Position: BOTTOM
  • Width: 25 mm
  • uPs/uCs/Peripheral ICs Type: DIGITAL SIGNAL PROCESSOR, MIXED
  • TMS320TCI6614XCMS CAD Models Information
    • Part Symbol photo
    • Footprint
    • 3D Model
    FAQ (Frequently Asked Questions) for TMS320TCI6614XCMS
    • Q:Where can I buy TMS320TCI6614XCMS?

      A:We have the TMS320TCI6614XCMS available for sell at the moment, you can contact us by email for the price and delivery time.

    • Q:How do I place an order and pay it?

      A:You can place an order by email, and you can pay by Bank Transfer or Paypal.

    • Q:How long I can receive the shipment after order?

      A:We will ship within 1 day after order, and you will receive it in around 2-3 days.

    • Q:When can I receive a reply after sending email?

      A:We will reply you within 24 hours.

    • Q:How do I use TMS320TCI6614XCMS for my products?

      A:Please refer to the application note.

    • Q:How can I download a datasheet for TMS320TCI6614XCMS?

      A:You can download the datasheet on our product page, or you can send us by email to request a datasheet.

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