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Manufacturer / Brand: NXP Semiconductors
Details: LPC1311FHN33 - 8kB Flash, 4kB SRAM QFN 32-Pin
HTS Code: 8542.31.00.01
Quantity Available: Over 84560 Pieces
Datasheet for LPC1311FHN33,551:
Product Parameters
- Manufacturer Part Number : LPC1311FHN33,551
- Manufacturer : NXP Semiconductors
- Description : LPC1311FHN33 - 8kB Flash, 4kB SRAM QFN 32-Pin
- Reference Price : USD 1.26
- Our Price : We have a better price, contact us by email
- Function : -
- CPU Family: -
- RAM Type: -
- Status : Active (In Production)
- ROHS Status : Rohs Compliant
- Package Type : -
- Standard Packing Type : Reel / Tube / Tray / Box
- Standard Packing Quantity : -
- Working Temperature : -
- Other Part Number : LPC1311FHN33,551
- Shipping methods : DHL FEDEX UPS TNT
- Delivery Time : Ship within 1 day.
- Manufacturer Production time : 6-8 weeks (Normally have stocks)
- Weight : 0.001KG
Contact us to check the best price and real time inventory quantity for LPC1311FHN33,551. If you need any more information about LPC1311FHN33,551, you can also send us by email. Our email is [email protected], we will reply you in 12 hours.
Related Microcontroller IC
Detailed Description of LPC1311FHN33,551
Manufacturer Part Number: LPC1311FHN33,551Brand Name: NXP SemiconductorRohs Code: YesPart Life Cycle Code: ActiveIhs Manufacturer: NXP SEMICONDUCTORSPart Package Code: QFNPackage Description: HVQCCN, LCC32,.27SQ,25Pin Count: 32Manufacturer Package Code: SOT865-3Reach Compliance Code: compliantECCN Code: EAR99HTS Code: 8542.31.00.01Manufacturer: NXP SemiconductorsRisk Rank: 1.71Has ADC: YESBit Size: 32CPU Family: ARM7Clock Frequency-Max: 25 MHzDAC Channels: NODMA Channels: NOJESD-30 Code: S-PQCC-N33JESD-609 Code: e4Length: 7 mmMoisture Sensitivity Level: 3Number of I/O Lines: 28Number of Terminals: 33On Chip Program ROM Width: 8Operating Temperature-Max: 85 °COperating Temperature-Min: -40 °CPWM Channels: NOPackage Body Material: PLASTIC/EPOXYPackage Code: HVQCCNPackage Equivalence Code: LCC32,.27SQ,25Package Shape: SQUAREPackage Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILEPeak Reflow Temperature (Cel): 260Power Supplies: 3.3 VQualification Status: Not QualifiedRAM (bytes): 4096ROM (words): 8192ROM Programmability: FLASHSeated Height-Max: 1 mmSpeed: 72 MHzSubcategory: MicrocontrollersSupply Voltage-Max: 3.6 VSupply Voltage-Min: 2 VSupply Voltage-Nom: 3.3 VSurface Mount: YESTechnology: CMOSTemperature Grade: INDUSTRIALTerminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)Terminal Form: NO LEADTerminal Pitch: 0.65 mmTerminal Position: QUADTime@Peak Reflow Temperature-Max (s): NOT SPECIFIEDWidth: 7 mmuPs/uCs/Peripheral ICs Type: MICROCONTROLLER
LPC1311FHN33,551 CAD Models Information
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FAQ (Frequently Asked Questions) for LPC1311FHN33,551
Q:Where can I buy LPC1311FHN33,551?
A:We have the LPC1311FHN33,551 available for sell at the moment, you can contact us by email for the price and delivery time.
Q:How do I place an order and pay it?
A:You can place an order by email, and you can pay by Bank Transfer or Paypal.
Q:How long I can receive the shipment after order?
A:We will ship within 1 day after order, and you will receive it in around 2-3 days.
Q:When can I receive a reply after sending email?
A:We will reply you within 24 hours.
Q:How do I use LPC1311FHN33,551 for my products?
A:Please refer to the application note.
Q:How can I download a datasheet for LPC1311FHN33,551?
A:You can download the datasheet on our product page, or you can send us by email to request a datasheet.
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