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Manufacturer / Brand: NXP Semiconductors
Details: IC 32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SOT-407-1, MS-026, LQFP-100, Microcontroller
HTS Code: 8542.31.00.01
Quantity Available: Over 144100 Pieces

Datasheet for LPC1768FBD100:

LPC1768FBD100 datasheet
Price for LPC1768FBD100
Product Parameters
  • Manufacturer Part Number : LPC1768FBD100
  • Manufacturer : NXP Semiconductors
  • Description : IC 32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SOT-407-1, MS-026, LQFP-100, Microcontroller
  • Reference Price : USD 10.08
  • Our Price : We have a better price, contact us by email
  • Function : -
  • CPU Family: -
  • RAM Type: -
  • Status : Active (In Production)
  • ROHS Status : Rohs Compliant
  • Package Type : -
  • Standard Packing Type : Reel / Tube / Tray / Box
  • Standard Packing Quantity : -
  • Working Temperature : -
  • Other Part Number : LPC1768FBD100
  • Shipping methods : DHL FEDEX UPS TNT
  • Delivery Time : Ship within 1 day.
  • Manufacturer Production time : 6-8 weeks (Normally have stocks)
  • Weight : 0.001KG

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Detailed Description of LPC1768FBD100
  • Manufacturer Part Number: LPC1768FBD100
  • Pbfree Code: Yes
  • Rohs Code: Yes
  • Part Life Cycle Code: Active
  • Ihs Manufacturer: NXP SEMICONDUCTORS
  • Part Package Code: QFP
  • Package Description: LFQFP, QFP100,.63SQ,20
  • Pin Count: 100
  • Reach Compliance Code: compliant
  • HTS Code: 8542.31.00.01
  • Manufacturer: NXP Semiconductors
  • Risk Rank: 1.86
  • Has ADC: YES
  • Bit Size: 32
  • CPU Family: ARM7
  • Clock Frequency-Max: 25 MHz
  • DAC Channels: YES
  • DMA Channels: YES
  • JESD-30 Code: S-PQFP-G100
  • JESD-609 Code: e3
  • Length: 14 mm
  • Moisture Sensitivity Level: 3
  • Number of I/O Lines: 70
  • Number of Terminals: 100
  • Operating Temperature-Max: 85 °C
  • Operating Temperature-Min: -40 °C
  • PWM Channels: YES
  • Package Body Material: PLASTIC/EPOXY
  • Package Code: LFQFP
  • Package Equivalence Code: QFP100,.63SQ,20
  • Package Shape: SQUARE
  • Package Style: FLATPACK, LOW PROFILE, FINE PITCH
  • Peak Reflow Temperature (Cel): 260
  • Power Supplies: 2.5/3.3 V
  • Qualification Status: Not Qualified
  • RAM (bytes): 65536
  • ROM (words): 131072
  • ROM Programmability: FLASH
  • Seated Height-Max: 1.6 mm
  • Speed: 100 MHz
  • Subcategory: Microcontrollers
  • Supply Voltage-Max: 3.6 V
  • Supply Voltage-Min: 2.4 V
  • Supply Voltage-Nom: 3.3 V
  • Surface Mount: YES
  • Technology: CMOS
  • Temperature Grade: INDUSTRIAL
  • Terminal Finish: Tin (Sn)
  • Terminal Form: GULL WING
  • Terminal Pitch: 0.5 mm
  • Terminal Position: QUAD
  • Time@Peak Reflow Temperature-Max (s): 30
  • Width: 14 mm
  • uPs/uCs/Peripheral ICs Type: MICROCONTROLLER, RISC
  • LPC1768FBD100 CAD Models Information
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    FAQ (Frequently Asked Questions) for LPC1768FBD100
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