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Manufacturer / Brand: Texas Instruments
Details: Enhanced Product 16/32 Bit RISC Flash Arm Cortex-R4F, EMAC, FlexRay 337-NFBGA -40 to 125
HTS Code: 8542.31.00.01
Quantity Available: Over 53200 Pieces
Datasheet for TMS5703137CGWTQEP:
Product Parameters
- Manufacturer Part Number : TMS5703137CGWTQEP
- Manufacturer : Texas Instruments
- Description : Enhanced Product 16/32 Bit RISC Flash Arm Cortex-R4F, EMAC, FlexRay 337-NFBGA -40 to 125
- Reference Price : USD 47.43
- Our Price : We have a better price, contact us by email
- Function : -
- CPU Family: -
- RAM Type: -
- Status : Active (In Production)
- ROHS Status : Rohs Compliant
- Package Type : -
- Standard Packing Type : Reel / Tube / Tray / Box
- Standard Packing Quantity : -
- Working Temperature : -
- Other Part Number : TMS5703137CGWTQEP
- Shipping methods : DHL FEDEX UPS TNT
- Delivery Time : Ship within 1 day.
- Manufacturer Production time : 6-8 weeks (Normally have stocks)
- Weight : 0.001KG
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Related Microcontroller IC
Detailed Description of TMS5703137CGWTQEP
Manufacturer Part Number: TMS5703137CGWTQEPBrand Name: Texas InstrumentsPart Life Cycle Code: ActiveIhs Manufacturer: TEXAS INSTRUMENTS INCPart Package Code: BGAPackage Description: PLASTIC, NFBGA-337Pin Count: 337Reach Compliance Code: not_compliantECCN Code: 3A991.A.2HTS Code: 8542.31.00.01Factory Lead Time: 6 WeeksManufacturer: Texas InstrumentsRisk Rank: 1.13Has ADC: YESAdditional Feature: ALSO REQUIRES 3.3 V I/O SUPPLYAddress Bus Width: 22Bit Size: 32Boundary Scan: YESCPU Family: CORTEX-R4FClock Frequency-Max: 80 MHzDAC Channels: NODMA Channels: YESExternal Data Bus Width: 32Format: FLOATING POINTIntegrated Cache: NOJESD-30 Code: S-PBGA-B337JESD-609 Code: e0Length: 16 mmLow Power Mode: YESMoisture Sensitivity Level: 3Number of DMA Channels: 16Number of I/O Lines: 16Number of Serial I/Os: 11Number of Terminals: 337Number of Timers: 51On Chip Data RAM Width: 8On Chip Program ROM Width: 8Operating Temperature-Max: 125 °COperating Temperature-Min: -40 °CPWM Channels: YESPackage Body Material: PLASTIC/EPOXYPackage Code: LFBGAPackage Equivalence Code: BGA337,19X19,32Package Shape: SQUAREPackage Style: GRID ARRAY, LOW PROFILE, FINE PITCHPeak Reflow Temperature (Cel): 220Power Supplies: 1.2,3.3 VRAM (bytes): 262144RAM (words): 256ROM (words): 3145728ROM Programmability: FLASHSeated Height-Max: 1.4 mmSpeed: 180 MHzSubcategory: MicrocontrollersSupply Current-Max: 440 mASupply Voltage-Max: 1.32 VSupply Voltage-Min: 1.14 VSupply Voltage-Nom: 1.2 VSurface Mount: YESTechnology: CMOSTemperature Grade: AUTOMOTIVETerminal Finish: Tin/Lead (Sn/Pb)Terminal Form: BALLTerminal Pitch: 0.8 mmTerminal Position: BOTTOMTime@Peak Reflow Temperature-Max (s): NOT SPECIFIEDWidth: 16 mmuPs/uCs/Peripheral ICs Type: MICROCONTROLLER, RISC
TMS5703137CGWTQEP CAD Models Information
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FAQ (Frequently Asked Questions) for TMS5703137CGWTQEP
Q:Where can I buy TMS5703137CGWTQEP?
A:We have the TMS5703137CGWTQEP available for sell at the moment, you can contact us by email for the price and delivery time.
Q:How do I place an order and pay it?
A:You can place an order by email, and you can pay by Bank Transfer or Paypal.
Q:How long I can receive the shipment after order?
A:We will ship within 1 day after order, and you will receive it in around 2-3 days.
Q:When can I receive a reply after sending email?
A:We will reply you within 24 hours.
Q:How do I use TMS5703137CGWTQEP for my products?
A:Please refer to the application note.
Q:How can I download a datasheet for TMS5703137CGWTQEP?
A:You can download the datasheet on our product page, or you can send us by email to request a datasheet.
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