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Manufacturer / Brand: Texas Instruments
Details: Multicore DSP+ARM KeyStone II System-on-Chip (SoC) 1517-FCBGA -40 to 100
HTS Code: 8542.31.00.01
Quantity Available: Over 126290 Pieces

Datasheet for 66AK2H12BAAWA2:

66AK2H12BAAWA2 datasheet
Price for 66AK2H12BAAWA2
Product Parameters
  • Manufacturer Part Number : 66AK2H12BAAWA2
  • Manufacturer : Texas Instruments
  • Description : Multicore DSP+ARM KeyStone II System-on-Chip (SoC) 1517-FCBGA -40 to 100
  • Reference Price : USD 520.99
  • Our Price : We have a better price, contact us by email
  • Function : -
  • CPU Family: -
  • RAM Type: -
  • Status : Active (In Production)
  • ROHS Status : Rohs Compliant
  • Package Type : -
  • Standard Packing Type : Reel / Tube / Tray / Box
  • Standard Packing Quantity : -
  • Working Temperature : -
  • Other Part Number : 66AK2H12BAAWA2
  • Shipping methods : DHL FEDEX UPS TNT
  • Delivery Time : Ship within 1 day.
  • Manufacturer Production time : 6-8 weeks (Normally have stocks)
  • Weight : 0.001KG

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Detailed Description of 66AK2H12BAAWA2
  • Manufacturer Part Number: 66AK2H12BAAWA2
  • Brand Name: Texas Instruments
  • Rohs Code: Yes
  • Part Life Cycle Code: Obsolete
  • Ihs Manufacturer: TEXAS INSTRUMENTS INC
  • Package Description: FCBGA-1517
  • Reach Compliance Code: compliant
  • Factory Lead Time: 12 Weeks
  • Manufacturer: Texas Instruments
  • Risk Rank: 8.52
  • Address Bus Width: 16
  • Boundary Scan: YES
  • External Data Bus Width: 64
  • Format: FLOATING POINT
  • Integrated Cache: YES
  • JESD-30 Code: S-PBGA-B1517
  • JESD-609 Code: e1
  • Length: 40 mm
  • Low Power Mode: YES
  • Moisture Sensitivity Level: 4
  • Number of Terminals: 1517
  • Package Body Material: PLASTIC/EPOXY
  • Package Code: BGA
  • Package Shape: SQUARE
  • Package Style: GRID ARRAY
  • Peak Reflow Temperature (Cel): 245
  • Seated Height-Max: 3.75 mm
  • Speed: 1200 MHz
  • Supply Voltage-Max: 1.05 V
  • Supply Voltage-Min: 0.95 V
  • Supply Voltage-Nom: 1 V
  • Surface Mount: YES
  • Technology: CMOS
  • Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
  • Terminal Form: BALL
  • Terminal Pitch: 1 mm
  • Terminal Position: BOTTOM
  • Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
  • Width: 40 mm
  • uPs/uCs/Peripheral ICs Type: MICROPROCESSOR, RISC
  • 66AK2H12BAAWA2 CAD Models Information
    • Part Symbol photo
    • Footprint
    • 3D Model
    FAQ (Frequently Asked Questions) for 66AK2H12BAAWA2
    • Q:Where can I buy 66AK2H12BAAWA2?

      A:We have the 66AK2H12BAAWA2 available for sell at the moment, you can contact us by email for the price and delivery time.

    • Q:How do I place an order and pay it?

      A:You can place an order by email, and you can pay by Bank Transfer or Paypal.

    • Q:How long I can receive the shipment after order?

      A:We will ship within 1 day after order, and you will receive it in around 2-3 days.

    • Q:When can I receive a reply after sending email?

      A:We will reply you within 24 hours.

    • Q:How do I use 66AK2H12BAAWA2 for my products?

      A:Please refer to the application note.

    • Q:How can I download a datasheet for 66AK2H12BAAWA2?

      A:You can download the datasheet on our product page, or you can send us by email to request a datasheet.

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