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Manufacturer / Brand: Texas Instruments
Details: Sitara processor: Arm Cortex-A8, 1Gb Ethernet, display, CAN 324-NFBGA -40 to 105
HTS Code: 8542.31.00.01
Quantity Available: Over 95910 Pieces

Datasheet for AM3352BZCZA30:

AM3352BZCZA30 datasheet
Price for AM3352BZCZA30
Product Parameters
  • Manufacturer Part Number : AM3352BZCZA30
  • Manufacturer : Texas Instruments
  • Description : Sitara processor: Arm Cortex-A8, 1Gb Ethernet, display, CAN 324-NFBGA -40 to 105
  • Reference Price : USD 9.76
  • Our Price : We have a better price, contact us by email
  • Function : -
  • CPU Family: -
  • RAM Type: -
  • Status : Active (In Production)
  • ROHS Status : Rohs Compliant
  • Package Type : -
  • Standard Packing Type : Reel / Tube / Tray / Box
  • Standard Packing Quantity : -
  • Working Temperature : -
  • Other Part Number : AM3352BZCZA30
  • Shipping methods : DHL FEDEX UPS TNT
  • Delivery Time : Ship within 1 day.
  • Manufacturer Production time : 6-8 weeks (Normally have stocks)
  • Weight : 0.001KG

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Detailed Description of AM3352BZCZA30
  • Manufacturer Part Number: AM3352BZCZA30
  • Brand Name: Texas Instruments
  • Pbfree Code: Yes
  • Rohs Code: Yes
  • Part Life Cycle Code: Active
  • Ihs Manufacturer: TEXAS INSTRUMENTS INC
  • Package Description: NFBGA-324
  • Reach Compliance Code: compliant
  • ECCN Code: 5A992.C
  • HTS Code: 8542.31.00.01
  • Factory Lead Time: 6 Weeks
  • Manufacturer: Texas Instruments
  • Risk Rank: 1.25
  • Additional Feature: ALSO OPERATES AT MIN 0.912 V
  • Address Bus Width: 28
  • Bit Size: 32
  • Boundary Scan: YES
  • Clock Frequency-Max: 26 MHz
  • External Data Bus Width: 16
  • Format: FIXED POINT
  • Integrated Cache: YES
  • JESD-30 Code: S-PBGA-B324
  • JESD-609 Code: e1
  • Length: 15 mm
  • Low Power Mode: YES
  • Moisture Sensitivity Level: 3
  • Number of DMA Channels: 64
  • Number of Terminals: 324
  • On Chip Data RAM Width: 8
  • Operating Temperature-Max: 105 °C
  • Operating Temperature-Min: -40 °C
  • Package Body Material: PLASTIC/EPOXY
  • Package Code: LFBGA
  • Package Equivalence Code: BGA324,18X18,32
  • Package Shape: SQUARE
  • Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH
  • Peak Reflow Temperature (Cel): 260
  • Power Supplies: 0.95/1.1 V
  • Qualification Status: Not Qualified
  • RAM (words): 131072
  • Seated Height-Max: 1.4 mm
  • Speed: 300 MHz
  • Subcategory: Microprocessors
  • Supply Current-Max: 400 mA
  • Supply Voltage-Max: 1.144 V
  • Supply Voltage-Min: 1.056 V
  • Supply Voltage-Nom: 1.1 V
  • Surface Mount: YES
  • Technology: CMOS
  • Temperature Grade: INDUSTRIAL
  • Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
  • Terminal Form: BALL
  • Terminal Pitch: 0.8 mm
  • Terminal Position: BOTTOM
  • Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
  • Width: 15 mm
  • uPs/uCs/Peripheral ICs Type: MICROPROCESSOR, RISC
  • AM3352BZCZA30 CAD Models Information
    • Part Symbol photo
    • Footprint
    • 3D Model
    FAQ (Frequently Asked Questions) for AM3352BZCZA30
    • Q:Where can I buy AM3352BZCZA30?

      A:We have the AM3352BZCZA30 available for sell at the moment, you can contact us by email for the price and delivery time.

    • Q:How do I place an order and pay it?

      A:You can place an order by email, and you can pay by Bank Transfer or Paypal.

    • Q:How long I can receive the shipment after order?

      A:We will ship within 1 day after order, and you will receive it in around 2-3 days.

    • Q:When can I receive a reply after sending email?

      A:We will reply you within 24 hours.

    • Q:How do I use AM3352BZCZA30 for my products?

      A:Please refer to the application note.

    • Q:How can I download a datasheet for AM3352BZCZA30?

      A:You can download the datasheet on our product page, or you can send us by email to request a datasheet.

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