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Manufacturer / Brand: Microchip Technology Inc
Details: IC MCU 32BIT 128KB ROM 217BGA
HTS Code: 8542.31.00.01
Quantity Available: Over 106990 Pieces

Datasheet for AT91SAM9CN11-CU:

AT91SAM9CN11-CU datasheet
Price for AT91SAM9CN11-CU
Product Parameters
  • Manufacturer Part Number : AT91SAM9CN11-CU
  • Manufacturer : Microchip Technology Inc
  • Description : IC MCU 32BIT 128KB ROM 217BGA
  • Reference Price : USD 7.4615
  • Our Price : We have a better price, contact us by email
  • Function : -
  • CPU Family: -
  • RAM Type: -
  • Status : Active (In Production)
  • ROHS Status : Rohs Compliant
  • Package Type : -
  • Standard Packing Type : Reel / Tube / Tray / Box
  • Standard Packing Quantity : -
  • Working Temperature : -
  • Other Part Number : AT91SAM9CN11-CU
  • Shipping methods : DHL FEDEX UPS TNT
  • Delivery Time : Ship within 1 day.
  • Manufacturer Production time : 6-8 weeks (Normally have stocks)
  • Weight : 0.001KG

Contact us to check the best price and real time inventory quantity for AT91SAM9CN11-CU. If you need any more information about AT91SAM9CN11-CU, you can also send us by email. Our email is [email protected], we will reply you in 12 hours.

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Detailed Description of AT91SAM9CN11-CU
  • Manufacturer Part Number: AT91SAM9CN11-CU
  • Pbfree Code: Yes
  • Rohs Code: Yes
  • Part Life Cycle Code: Active
  • Ihs Manufacturer: MICROCHIP TECHNOLOGY INC
  • Package Description: LFBGA, BGA217,17X17,32
  • Reach Compliance Code: compliant
  • Factory Lead Time: 12 Weeks
  • Manufacturer: Microchip Technology Inc
  • Risk Rank: 2.11
  • Address Bus Width: 26
  • Bit Size: 32
  • Boundary Scan: YES
  • Clock Frequency-Max: 50 MHz
  • External Data Bus Width: 32
  • Format: FIXED POINT
  • Integrated Cache: YES
  • JESD-30 Code: S-PBGA-B217
  • JESD-609 Code: e1
  • Length: 15 mm
  • Low Power Mode: YES
  • Moisture Sensitivity Level: 3
  • Number of Terminals: 217
  • Operating Temperature-Max: 85 °C
  • Operating Temperature-Min: -40 °C
  • Package Body Material: PLASTIC/EPOXY
  • Package Code: LFBGA
  • Package Equivalence Code: BGA217,17X17,32
  • Package Shape: SQUARE
  • Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH
  • Peak Reflow Temperature (Cel): 260
  • Power Supplies: 1,1.8/3.3,3.3 V
  • Qualification Status: Not Qualified
  • Seated Height-Max: 1.4 mm
  • Speed: 400 MHz
  • Subcategory: Microprocessors
  • Supply Voltage-Max: 1.1 V
  • Supply Voltage-Min: 0.9 V
  • Supply Voltage-Nom: 1 V
  • Surface Mount: YES
  • Technology: CMOS
  • Temperature Grade: INDUSTRIAL
  • Terminal Finish: TIN SILVER COPPER
  • Terminal Form: BALL
  • Terminal Pitch: 0.8 mm
  • Terminal Position: BOTTOM
  • Time@Peak Reflow Temperature-Max (s): 40
  • Width: 15 mm
  • uPs/uCs/Peripheral ICs Type: MICROPROCESSOR, RISC
  • AT91SAM9CN11-CU CAD Models Information
    • Part Symbol photo
    • Footprint
    • 3D Model
    FAQ (Frequently Asked Questions) for AT91SAM9CN11-CU
    • Q:Where can I buy AT91SAM9CN11-CU?

      A:We have the AT91SAM9CN11-CU available for sell at the moment, you can contact us by email for the price and delivery time.

    • Q:How do I place an order and pay it?

      A:You can place an order by email, and you can pay by Bank Transfer or Paypal.

    • Q:How long I can receive the shipment after order?

      A:We will ship within 1 day after order, and you will receive it in around 2-3 days.

    • Q:When can I receive a reply after sending email?

      A:We will reply you within 24 hours.

    • Q:How do I use AT91SAM9CN11-CU for my products?

      A:Please refer to the application note.

    • Q:How can I download a datasheet for AT91SAM9CN11-CU?

      A:You can download the datasheet on our product page, or you can send us by email to request a datasheet.

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