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Manufacturer / Brand: Microchip Technology Inc
Details: RISC Microprocessor
HTS Code: 8542.31.00.01
Quantity Available: Over 98960 Pieces

Datasheet for ATSAMA5D27C-LD2G-CU:

ATSAMA5D27C-LD2G-CU datasheet
Price for ATSAMA5D27C-LD2G-CU
Product Parameters
  • Manufacturer Part Number : ATSAMA5D27C-LD2G-CU
  • Manufacturer : Microchip Technology Inc
  • Description : RISC Microprocessor
  • Reference Price : USD 17.64
  • Our Price : We have a better price, contact us by email
  • Function : -
  • CPU Family: -
  • RAM Type: -
  • Status : Active (In Production)
  • ROHS Status : Rohs Compliant
  • Package Type : -
  • Standard Packing Type : Reel / Tube / Tray / Box
  • Standard Packing Quantity : -
  • Working Temperature : -
  • Other Part Number : ATSAMA5D27C-LD2G-CU
  • Shipping methods : DHL FEDEX UPS TNT
  • Delivery Time : Ship within 1 day.
  • Manufacturer Production time : 6-8 weeks (Normally have stocks)
  • Weight : 0.001KG

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Detailed Description of ATSAMA5D27C-LD2G-CU
  • Manufacturer Part Number: ATSAMA5D27C-LD2G-CU
  • Part Life Cycle Code: Active
  • Ihs Manufacturer: MICROCHIP TECHNOLOGY INC
  • Package Description: TFBGA, BGA361,19X19,32
  • Reach Compliance Code: compliant
  • Factory Lead Time: 12 Weeks
  • Manufacturer: Microchip Technology Inc
  • Risk Rank: 5.69
  • Bit Size: 32
  • Boundary Scan: YES
  • Clock Frequency-Max: 24 MHz
  • Format: FLOATING POINT
  • Integrated Cache: YES
  • JESD-30 Code: S-PBGA-G361
  • Length: 16 mm
  • Low Power Mode: YES
  • Number of DMA Channels: 51
  • Number of Serial I/Os: 10
  • Number of Terminals: 361
  • On Chip Data RAM Width: 32
  • Operating Temperature-Max: 85 °C
  • Operating Temperature-Min: -40 °C
  • Package Body Material: PLASTIC/EPOXY
  • Package Code: TFBGA
  • Package Equivalence Code: BGA361,19X19,32
  • Package Shape: SQUARE
  • Package Style: GRID ARRAY, THIN PROFILE, FINE PITCH
  • RAM (words): 32768
  • Seated Height-Max: 1.2 mm
  • Speed: 500 MHz
  • Supply Voltage-Max: 1.3 V
  • Supply Voltage-Min: 1.14 V
  • Supply Voltage-Nom: 1.2 V
  • Surface Mount: YES
  • Technology: CMOS
  • Temperature Grade: INDUSTRIAL
  • Terminal Form: BALL
  • Terminal Pitch: 0.8 mm
  • Terminal Position: BOTTOM
  • Width: 16 mm
  • uPs/uCs/Peripheral ICs Type: MICROPROCESSOR, RISC
  • ATSAMA5D27C-LD2G-CU CAD Models Information
    • Part Symbol photo
    • Footprint
    • 3D Model
    FAQ (Frequently Asked Questions) for ATSAMA5D27C-LD2G-CU
    • Q:Where can I buy ATSAMA5D27C-LD2G-CU?

      A:We have the ATSAMA5D27C-LD2G-CU available for sell at the moment, you can contact us by email for the price and delivery time.

    • Q:How do I place an order and pay it?

      A:You can place an order by email, and you can pay by Bank Transfer or Paypal.

    • Q:How long I can receive the shipment after order?

      A:We will ship within 1 day after order, and you will receive it in around 2-3 days.

    • Q:When can I receive a reply after sending email?

      A:We will reply you within 24 hours.

    • Q:How do I use ATSAMA5D27C-LD2G-CU for my products?

      A:Please refer to the application note.

    • Q:How can I download a datasheet for ATSAMA5D27C-LD2G-CU?

      A:You can download the datasheet on our product page, or you can send us by email to request a datasheet.

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