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Manufacturer / Brand: Renesas Electronics Corporation
Details: 32-BIT, 200MHz, RISC PROCESSOR, PBGA256, BGA-256
HTS Code: 8542.31.00.01
Quantity Available: Over 129120 Pieces

Datasheet for HD6417751RBP200:

HD6417751RBP200 datasheet
Price for HD6417751RBP200
Product Parameters
  • Manufacturer Part Number : HD6417751RBP200
  • Manufacturer : Renesas Electronics Corporation
  • Description : 32-BIT, 200MHz, RISC PROCESSOR, PBGA256, BGA-256
  • Reference Price : USD 13.53
  • Our Price : We have a better price, contact us by email
  • Function : -
  • CPU Family: -
  • RAM Type: -
  • Status : Active (In Production)
  • ROHS Status : Rohs Compliant
  • Package Type : -
  • Standard Packing Type : Reel / Tube / Tray / Box
  • Standard Packing Quantity : -
  • Working Temperature : -
  • Other Part Number : HD6417751RBP200
  • Shipping methods : DHL FEDEX UPS TNT
  • Delivery Time : Ship within 1 day.
  • Manufacturer Production time : 6-8 weeks (Normally have stocks)
  • Weight : 0.001KG

Contact us to check the best price and real time inventory quantity for HD6417751RBP200. If you need any more information about HD6417751RBP200, you can also send us by email. Our email is [email protected], we will reply you in 12 hours.

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Detailed Description of HD6417751RBP200
  • Manufacturer Part Number: HD6417751RBP200
  • Pbfree Code: No
  • Rohs Code: No
  • Part Life Cycle Code: Not Recommended
  • Ihs Manufacturer: RENESAS ELECTRONICS CORP
  • Part Package Code: BGA
  • Package Description: BGA, BGA256,20X20,50
  • Pin Count: 256
  • Reach Compliance Code: compliant
  • ECCN Code: 3A991.A.2
  • HTS Code: 8542.31.00.01
  • Factory Lead Time: 1 Week
  • Manufacturer: Renesas Electronics Corporation
  • Risk Rank: 5.45
  • Address Bus Width: 26
  • Bit Size: 32
  • Boundary Scan: YES
  • Clock Frequency-Max: 34 MHz
  • External Data Bus Width: 32
  • Format: FLOATING POINT
  • Integrated Cache: YES
  • JESD-30 Code: S-PBGA-B256
  • JESD-609 Code: e0
  • Length: 27 mm
  • Low Power Mode: YES
  • Number of Terminals: 256
  • Operating Temperature-Max: 75 °C
  • Operating Temperature-Min: -20 °C
  • Package Body Material: PLASTIC/EPOXY
  • Package Code: BGA
  • Package Equivalence Code: BGA256,20X20,50
  • Package Shape: SQUARE
  • Package Style: GRID ARRAY
  • Peak Reflow Temperature (Cel): NOT SPECIFIED
  • Power Supplies: 1.5,3.3 V
  • Qualification Status: Not Qualified
  • Seated Height-Max: 2.1 mm
  • Speed: 200 MHz
  • Subcategory: Microprocessors
  • Supply Voltage-Max: 1.6 V
  • Supply Voltage-Min: 1.35 V
  • Supply Voltage-Nom: 1.5 V
  • Surface Mount: YES
  • Technology: CMOS
  • Temperature Grade: COMMERCIAL EXTENDED
  • Terminal Finish: TIN LEAD
  • Terminal Form: BALL
  • Terminal Pitch: 1.27 mm
  • Terminal Position: BOTTOM
  • Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
  • Width: 27 mm
  • uPs/uCs/Peripheral ICs Type: MICROPROCESSOR, RISC
  • HD6417751RBP200 CAD Models Information
    • Part Symbol photo
    • Footprint
    • 3D Model
    FAQ (Frequently Asked Questions) for HD6417751RBP200
    • Q:Where can I buy HD6417751RBP200?

      A:We have the HD6417751RBP200 available for sell at the moment, you can contact us by email for the price and delivery time.

    • Q:How do I place an order and pay it?

      A:You can place an order by email, and you can pay by Bank Transfer or Paypal.

    • Q:How long I can receive the shipment after order?

      A:We will ship within 1 day after order, and you will receive it in around 2-3 days.

    • Q:When can I receive a reply after sending email?

      A:We will reply you within 24 hours.

    • Q:How do I use HD6417751RBP200 for my products?

      A:Please refer to the application note.

    • Q:How can I download a datasheet for HD6417751RBP200?

      A:You can download the datasheet on our product page, or you can send us by email to request a datasheet.

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