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IBM25PPC750GLECB2H33V picture
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Manufacturer / Brand: IBM
Details: RISC Microprocessor, 32-Bit, 800MHz, CMOS, CBGA292, 21 X 21 MM, 1 MM PITCH, CERAMIC, BGA-292
HTS Code: 8542.31.00.01
Quantity Available: Over 127890 Pieces

Datasheet for IBM25PPC750GLECB2H33V:

IBM25PPC750GLECB2H33V datasheet
Price for IBM25PPC750GLECB2H33V
Product Parameters
  • Manufacturer Part Number : IBM25PPC750GLECB2H33V
  • Manufacturer : IBM
  • Description : RISC Microprocessor, 32-Bit, 800MHz, CMOS, CBGA292, 21 X 21 MM, 1 MM PITCH, CERAMIC, BGA-292
  • Reference Price : USD 85.29
  • Our Price : We have a better price, contact us by email
  • Function : -
  • CPU Family: -
  • RAM Type: -
  • Status : Active (In Production)
  • ROHS Status : Rohs Compliant
  • Package Type : -
  • Standard Packing Type : Reel / Tube / Tray / Box
  • Standard Packing Quantity : -
  • Working Temperature : -
  • Other Part Number : IBM25PPC750GLECB2H33V
  • Shipping methods : DHL FEDEX UPS TNT
  • Delivery Time : Ship within 1 day.
  • Manufacturer Production time : 6-8 weeks (Normally have stocks)
  • Weight : 0.001KG

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Detailed Description of IBM25PPC750GLECB2H33V
  • Manufacturer Part Number: IBM25PPC750GLECB2H33V
  • Part Life Cycle Code: Contact Manufacturer
  • Ihs Manufacturer: IBM MICROELECTRONICS
  • Part Package Code: BGA
  • Package Description: BGA,
  • Pin Count: 292
  • Reach Compliance Code: unknown
  • Manufacturer: IBM
  • Risk Rank: 5.64
  • Address Bus Width: 32
  • Bit Size: 32
  • Boundary Scan: YES
  • Clock Frequency-Max: 200 MHz
  • External Data Bus Width: 64
  • Format: FLOATING POINT
  • Integrated Cache: YES
  • JESD-30 Code: S-CBGA-B292
  • JESD-609 Code: e0
  • Length: 21 mm
  • Low Power Mode: YES
  • Number of Terminals: 292
  • Package Body Material: CERAMIC, METAL-SEALED COFIRED
  • Package Code: BGA
  • Package Shape: SQUARE
  • Package Style: GRID ARRAY
  • Seated Height-Max: 3.137 mm
  • Speed: 800 MHz
  • Supply Voltage-Max: 1.5 V
  • Supply Voltage-Min: 1.4 V
  • Supply Voltage-Nom: 1.45 V
  • Surface Mount: YES
  • Technology: CMOS
  • Terminal Finish: TIN LEAD
  • Terminal Form: BALL
  • Terminal Pitch: 1 mm
  • Terminal Position: BOTTOM
  • Width: 21 mm
  • uPs/uCs/Peripheral ICs Type: MICROPROCESSOR, RISC
  • IBM25PPC750GLECB2H33V CAD Models Information
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    FAQ (Frequently Asked Questions) for IBM25PPC750GLECB2H33V
    • Q:Where can I buy IBM25PPC750GLECB2H33V?

      A:We have the IBM25PPC750GLECB2H33V available for sell at the moment, you can contact us by email for the price and delivery time.

    • Q:How do I place an order and pay it?

      A:You can place an order by email, and you can pay by Bank Transfer or Paypal.

    • Q:How long I can receive the shipment after order?

      A:We will ship within 1 day after order, and you will receive it in around 2-3 days.

    • Q:When can I receive a reply after sending email?

      A:We will reply you within 24 hours.

    • Q:How do I use IBM25PPC750GLECB2H33V for my products?

      A:Please refer to the application note.

    • Q:How can I download a datasheet for IBM25PPC750GLECB2H33V?

      A:You can download the datasheet on our product page, or you can send us by email to request a datasheet.

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