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Manufacturer / Brand: NXP Semiconductors
Details: RISC PROCESSOR
HTS Code: 8542.31.00.01
Quantity Available: Over 147920 Pieces

Datasheet for MCIMX6Q5EZK08AD:

MCIMX6Q5EZK08AD datasheet
Price for MCIMX6Q5EZK08AD
Product Parameters
  • Manufacturer Part Number : MCIMX6Q5EZK08AD
  • Manufacturer : NXP Semiconductors
  • Description : RISC PROCESSOR
  • Reference Price : USD 77.1
  • Our Price : We have a better price, contact us by email
  • Function : -
  • CPU Family: -
  • RAM Type: -
  • Status : Active (In Production)
  • ROHS Status : Rohs Compliant
  • Package Type : -
  • Standard Packing Type : Reel / Tube / Tray / Box
  • Standard Packing Quantity : -
  • Working Temperature : -
  • Other Part Number : MCIMX6Q5EZK08AD
  • Shipping methods : DHL FEDEX UPS TNT
  • Delivery Time : Ship within 1 day.
  • Manufacturer Production time : 6-8 weeks (Normally have stocks)
  • Weight : 0.001KG

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Detailed Description of MCIMX6Q5EZK08AD
  • Manufacturer Part Number: MCIMX6Q5EZK08AD
  • Rohs Code: Yes
  • Part Life Cycle Code: Active
  • Ihs Manufacturer: NXP SEMICONDUCTORS
  • Package Description: LFBGA,
  • Reach Compliance Code: compliant
  • ECCN Code: 5A992
  • HTS Code: 8542.31.00.01
  • Manufacturer: NXP Semiconductors
  • Risk Rank: 5.73
  • Additional Feature: 24MHZ NOMINAL FREQ AVAILABLE
  • Address Bus Width: 26
  • Boundary Scan: YES
  • External Data Bus Width: 32
  • Format: FIXED POINT
  • Integrated Cache: YES
  • JESD-30 Code: S-PBGA-B569
  • JESD-609 Code: e1
  • Length: 12 mm
  • Low Power Mode: YES
  • Moisture Sensitivity Level: 3
  • Number of Terminals: 569
  • Operating Temperature-Max: 105 °C
  • Operating Temperature-Min: -20 °C
  • Package Body Material: PLASTIC/EPOXY
  • Package Code: LFBGA
  • Package Shape: SQUARE
  • Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH
  • Peak Reflow Temperature (Cel): 260
  • Seated Height-Max: 1.25 mm
  • Speed: 800 MHz
  • Supply Voltage-Max: 1.5 V
  • Supply Voltage-Min: 1.275 V
  • Supply Voltage-Nom: 1.4 V
  • Surface Mount: YES
  • Technology: CMOS
  • Temperature Grade: OTHER
  • Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
  • Terminal Form: BALL
  • Terminal Pitch: 0.4 mm
  • Terminal Position: BOTTOM
  • Time@Peak Reflow Temperature-Max (s): 40
  • Width: 12 mm
  • uPs/uCs/Peripheral ICs Type: MICROPROCESSOR, RISC
  • MCIMX6Q5EZK08AD CAD Models Information
    • Part Symbol photo
    • Footprint
    • 3D Model
    FAQ (Frequently Asked Questions) for MCIMX6Q5EZK08AD
    • Q:Where can I buy MCIMX6Q5EZK08AD?

      A:We have the MCIMX6Q5EZK08AD available for sell at the moment, you can contact us by email for the price and delivery time.

    • Q:How do I place an order and pay it?

      A:You can place an order by email, and you can pay by Bank Transfer or Paypal.

    • Q:How long I can receive the shipment after order?

      A:We will ship within 1 day after order, and you will receive it in around 2-3 days.

    • Q:When can I receive a reply after sending email?

      A:We will reply you within 24 hours.

    • Q:How do I use MCIMX6Q5EZK08AD for my products?

      A:Please refer to the application note.

    • Q:How can I download a datasheet for MCIMX6Q5EZK08AD?

      A:You can download the datasheet on our product page, or you can send us by email to request a datasheet.

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