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Manufacturer / Brand: NXP Semiconductors
Details: 32-BIT, 350MHz, RISC PROCESSOR, PBGA255
HTS Code: 8542.31.00.01
Quantity Available: Over 133600 Pieces

Datasheet for MPC745CPX350LE:

MPC745CPX350LE datasheet
Price for MPC745CPX350LE
Product Parameters
  • Manufacturer Part Number : MPC745CPX350LE
  • Manufacturer : NXP Semiconductors
  • Description : 32-BIT, 350MHz, RISC PROCESSOR, PBGA255
  • Reference Price : USD 
  • Our Price : We have a better price, contact us by email
  • Function : -
  • CPU Family: -
  • RAM Type: -
  • Status : Active (In Production)
  • ROHS Status : Rohs Compliant
  • Package Type : -
  • Standard Packing Type : Reel / Tube / Tray / Box
  • Standard Packing Quantity : -
  • Working Temperature : -
  • Other Part Number : MPC745CPX350LE
  • Shipping methods : DHL FEDEX UPS TNT
  • Delivery Time : Ship within 1 day.
  • Manufacturer Production time : 6-8 weeks (Normally have stocks)
  • Weight : 0.001KG

Contact us to check the best price and real time inventory quantity for MPC745CPX350LE. If you need any more information about MPC745CPX350LE, you can also send us by email. Our email is [email protected], we will reply you in 12 hours.

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Detailed Description of MPC745CPX350LE
  • Manufacturer Part Number: MPC745CPX350LE
  • Rohs Code: No
  • Part Life Cycle Code: Obsolete
  • Ihs Manufacturer: NXP SEMICONDUCTORS
  • Package Description: 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-255
  • Reach Compliance Code: unknown
  • ECCN Code: 3A991.A.1
  • HTS Code: 8542.31.00.01
  • Manufacturer: NXP Semiconductors
  • Risk Rank: 5.75
  • Additional Feature: ALSO REQUIRES 2.5V OR 3.3V SUPPLY
  • Address Bus Width: 32
  • Bit Size: 32
  • Boundary Scan: YES
  • Clock Frequency-Max: 100 MHz
  • External Data Bus Width: 64
  • Format: FLOATING POINT
  • Integrated Cache: YES
  • JESD-30 Code: S-PBGA-B255
  • JESD-609 Code: e0
  • Length: 21 mm
  • Low Power Mode: YES
  • Moisture Sensitivity Level: 3
  • Number of Terminals: 255
  • Package Body Material: PLASTIC/EPOXY
  • Package Code: BGA
  • Package Shape: SQUARE
  • Package Style: GRID ARRAY
  • Peak Reflow Temperature (Cel): 245
  • Qualification Status: Not Qualified
  • Seated Height-Max: 2.8 mm
  • Speed: 350 MHz
  • Supply Voltage-Max: 2.1 V
  • Supply Voltage-Min: 1.8 V
  • Supply Voltage-Nom: 2 V
  • Surface Mount: YES
  • Technology: CMOS
  • Terminal Finish: Tin/Lead (Sn/Pb)
  • Terminal Form: BALL
  • Terminal Pitch: 1.27 mm
  • Terminal Position: BOTTOM
  • Time@Peak Reflow Temperature-Max (s): 30
  • Width: 21 mm
  • uPs/uCs/Peripheral ICs Type: MICROPROCESSOR, RISC
  • MPC745CPX350LE CAD Models Information
    • Part Symbol photo
    • Footprint
    • 3D Model
    FAQ (Frequently Asked Questions) for MPC745CPX350LE
    • Q:Where can I buy MPC745CPX350LE?

      A:We have the MPC745CPX350LE available for sell at the moment, you can contact us by email for the price and delivery time.

    • Q:How do I place an order and pay it?

      A:You can place an order by email, and you can pay by Bank Transfer or Paypal.

    • Q:How long I can receive the shipment after order?

      A:We will ship within 1 day after order, and you will receive it in around 2-3 days.

    • Q:When can I receive a reply after sending email?

      A:We will reply you within 24 hours.

    • Q:How do I use MPC745CPX350LE for my products?

      A:Please refer to the application note.

    • Q:How can I download a datasheet for MPC745CPX350LE?

      A:You can download the datasheet on our product page, or you can send us by email to request a datasheet.

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