MPC860PCZQ50D4 32-BIT, 50MHz, RISC PROCESSOR, PBGA357

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MPC860PCZQ50D4

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Microprocessors IC

Manufacturer / Brand: NXP Semiconductors

Details: 32-BIT, 50MHz, RISC PROCESSOR, PBGA357

HTS Code: 8542.31.00.01

Quantity Available: Over 86160 Pieces

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Datasheet for MPC860PCZQ50D4:

Product Parameters

Manufacturer Part Number : MPC860PCZQ50D4
Manufacturer : NXP Semiconductors
Description : 32-BIT, 50MHz, RISC PROCESSOR, PBGA357
Reference Price : USD 87.4685
Our Price : We have a better price, contact us by email
Function : -
CPU Family: -
RAM Type: -
Status : Active (In Production)
ROHS Status : Rohs Compliant
Package Type : -
Standard Packing Type : Reel / Tube / Tray / Box
Standard Packing Quantity : -
Working Temperature : -
Other Part Number : MPC860PCZQ50D4
Shipping methods : DHL FEDEX UPS TNT
Delivery Time : Ship within 1 day.
Manufacturer Production time : 6-8 weeks (Normally have stocks)
Weight : 0.001KG

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Detailed Description of MPC860PCZQ50D4

Manufacturer Part Number: MPC860PCZQ50D4

Rohs Code: No

Part Life Cycle Code: Not Recommended

Ihs Manufacturer: NXP SEMICONDUCTORS

Package Description: BGA, BGA357,19X19,50

Reach Compliance Code: unknown

ECCN Code: 3A991.A.2

HTS Code: 8542.31.00.01

Manufacturer: NXP Semiconductors

Risk Rank: 5.05

Address Bus Width: 32

Bit Size: 32

Boundary Scan: YES

Clock Frequency-Max: 50 MHz

External Data Bus Width: 32

Format: FIXED POINT

Integrated Cache: YES

JESD-30 Code: S-PBGA-B357

JESD-609 Code: e0

Length: 25 mm

Low Power Mode: YES

Moisture Sensitivity Level: 3

Number of Terminals: 357

Operating Temperature-Min: -40 °C

Package Body Material: PLASTIC/EPOXY

Package Code: BGA

Package Equivalence Code: BGA357,19X19,50

Package Shape: SQUARE

Package Style: GRID ARRAY

Peak Reflow Temperature (Cel): 245

Power Supplies: 3.3 V

Qualification Status: Not Qualified

Seated Height-Max: 2.52 mm

Speed: 50 MHz

Subcategory: Microprocessors

Supply Voltage-Max: 3.465 V

Supply Voltage-Min: 3.135 V

Supply Voltage-Nom: 3.3 V

Surface Mount: YES

Technology: CMOS

Terminal Finish: Tin/Lead (Sn/Pb)

Terminal Form: BALL

Terminal Pitch: 1.27 mm

Terminal Position: BOTTOM

Time@Peak Reflow Temperature-Max (s): 30

Width: 25 mm

uPs/uCs/Peripheral ICs Type: MICROPROCESSOR, RISC

MPC860PCZQ50D4 CAD Models Information

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3D Model

FAQ (Frequently Asked Questions) for MPC860PCZQ50D4

Q:Where can I buy MPC860PCZQ50D4?
A:We have the MPC860PCZQ50D4 available for sell at the moment, you can contact us by email for the price and delivery time.
Q:How do I place an order and pay it?
A:You can place an order by email, and you can pay by Bank Transfer or Paypal.
Q:How long I can receive the shipment after order?
A:We will ship within 1 day after order, and you will receive it in around 2-3 days.
Q:When can I receive a reply after sending email?
A:We will reply you within 24 hours.
Q:How do I use MPC860PCZQ50D4 for my products?
A:Please refer to the application note.
Q:How can I download a datasheet for MPC860PCZQ50D4?
A:You can download the datasheet on our product page, or you can send us by email to request a datasheet.

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Datasheet for MPC860PCZQ50D4:

Part Symbol photo

Footprint

3D Model