Hot Selling MCU IC
Logo
Enter a Part Number:
MPC885VR66 picture
Best Price NOW
Manufacturer / Brand: NXP Semiconductors
Details: 32-BIT, 66MHz, RISC PROCESSOR, PBGA357
HTS Code: 8542.31.00.01
Quantity Available: Over 63910 Pieces

Datasheet for MPC885VR66:

MPC885VR66 datasheet
Price for MPC885VR66
Product Parameters
  • Manufacturer Part Number : MPC885VR66
  • Manufacturer : NXP Semiconductors
  • Description : 32-BIT, 66MHz, RISC PROCESSOR, PBGA357
  • Reference Price : USD 24.728
  • Our Price : We have a better price, contact us by email
  • Function : -
  • CPU Family: -
  • RAM Type: -
  • Status : Active (In Production)
  • ROHS Status : Rohs Compliant
  • Package Type : -
  • Standard Packing Type : Reel / Tube / Tray / Box
  • Standard Packing Quantity : -
  • Working Temperature : -
  • Other Part Number : MPC885VR66
  • Shipping methods : DHL FEDEX UPS TNT
  • Delivery Time : Ship within 1 day.
  • Manufacturer Production time : 6-8 weeks (Normally have stocks)
  • Weight : 0.001KG

Contact us to check the best price and real time inventory quantity for MPC885VR66. If you need any more information about MPC885VR66, you can also send us by email. Our email is [email protected], we will reply you in 12 hours.

Request Quotation for MPC885VR66
Part Number (*) Quantity (*) Target Price ($)
Your Contact Information
Company(*) Country(*)
Name(*) Email(*)
Message:
ATTN: You also can contact us by email if urgent: [email protected] (We will reply quickly)
Related Microcontroller IC
Detailed Description of MPC885VR66
  • Manufacturer Part Number: MPC885VR66
  • Rohs Code: Yes
  • Part Life Cycle Code: Obsolete
  • Ihs Manufacturer: NXP SEMICONDUCTORS
  • Package Description: BGA, BGA357,19X19,50
  • Reach Compliance Code: compliant
  • ECCN Code: 5A002.A.1
  • HTS Code: 8542.31.00.01
  • Manufacturer: NXP Semiconductors
  • Risk Rank: 5.44
  • Address Bus Width: 32
  • Bit Size: 32
  • Boundary Scan: YES
  • External Data Bus Width: 32
  • Format: FIXED POINT
  • Integrated Cache: YES
  • JESD-30 Code: S-PBGA-B357
  • JESD-609 Code: e1
  • Length: 25 mm
  • Low Power Mode: YES
  • Moisture Sensitivity Level: 3
  • Number of Terminals: 357
  • Package Body Material: PLASTIC/EPOXY
  • Package Code: BGA
  • Package Equivalence Code: BGA357,19X19,50
  • Package Shape: SQUARE
  • Package Style: GRID ARRAY
  • Peak Reflow Temperature (Cel): 260
  • Power Supplies: 1.8,3.3 V
  • Qualification Status: Not Qualified
  • Seated Height-Max: 2.52 mm
  • Speed: 66 MHz
  • Subcategory: Microprocessors
  • Supply Voltage-Max: 1.9 V
  • Supply Voltage-Min: 1.7 V
  • Supply Voltage-Nom: 1.8 V
  • Surface Mount: YES
  • Technology: CMOS
  • Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
  • Terminal Form: BALL
  • Terminal Pitch: 1.27 mm
  • Terminal Position: BOTTOM
  • Time@Peak Reflow Temperature-Max (s): 40
  • Width: 25 mm
  • uPs/uCs/Peripheral ICs Type: MICROPROCESSOR, RISC
  • MPC885VR66 CAD Models Information
    • Part Symbol photo
    • Footprint
    • 3D Model
    FAQ (Frequently Asked Questions) for MPC885VR66
    • Q:Where can I buy MPC885VR66?

      A:We have the MPC885VR66 available for sell at the moment, you can contact us by email for the price and delivery time.

    • Q:How do I place an order and pay it?

      A:You can place an order by email, and you can pay by Bank Transfer or Paypal.

    • Q:How long I can receive the shipment after order?

      A:We will ship within 1 day after order, and you will receive it in around 2-3 days.

    • Q:When can I receive a reply after sending email?

      A:We will reply you within 24 hours.

    • Q:How do I use MPC885VR66 for my products?

      A:Please refer to the application note.

    • Q:How can I download a datasheet for MPC885VR66?

      A:You can download the datasheet on our product page, or you can send us by email to request a datasheet.

  • QUALITY GUARANTEE
  • FAST DELIVERY
  • BEST PRICE
  • Stocking Distributor for All series Microcontrollers MCU Microprocessors IC
    Copyright © 2001-2020 BYCHIPS Limited
    bychips.com