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Manufacturer / Brand: NEC Electronics Group
Details: RISC Microprocessor, 64-Bit, 200MHz, MOS, PBGA272, 29 X 29 MM, PLASTIC, BGA-272
HTS Code: 8542.31.00.01
Quantity Available: Over 109570 Pieces

Datasheet for UPD30500S2-200:

UPD30500S2-200 datasheet
Price for UPD30500S2-200
Product Parameters
  • Manufacturer Part Number : UPD30500S2-200
  • Manufacturer : NEC Electronics Group
  • Description : RISC Microprocessor, 64-Bit, 200MHz, MOS, PBGA272, 29 X 29 MM, PLASTIC, BGA-272
  • Reference Price : USD 
  • Our Price : We have a better price, contact us by email
  • Function : -
  • CPU Family: -
  • RAM Type: -
  • Status : Active (In Production)
  • ROHS Status : Rohs Compliant
  • Package Type : -
  • Standard Packing Type : Reel / Tube / Tray / Box
  • Standard Packing Quantity : -
  • Working Temperature : -
  • Other Part Number : UPD30500S2-200
  • Shipping methods : DHL FEDEX UPS TNT
  • Delivery Time : Ship within 1 day.
  • Manufacturer Production time : 6-8 weeks (Normally have stocks)
  • Weight : 0.001KG

Contact us to check the best price and real time inventory quantity for UPD30500S2-200. If you need any more information about UPD30500S2-200, you can also send us by email. Our email is [email protected], we will reply you in 12 hours.

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Detailed Description of UPD30500S2-200
  • Manufacturer Part Number: UPD30500S2-200
  • Part Life Cycle Code: Obsolete
  • Ihs Manufacturer: NEC ELECTRONICS CORP
  • Part Package Code: BGA
  • Package Description: LBGA,
  • Pin Count: 272
  • Reach Compliance Code: unknown
  • ECCN Code: 3A001.A.3
  • HTS Code: 8542.31.00.01
  • Manufacturer: NEC Electronics Group
  • Risk Rank: 5.75
  • Additional Feature: 5 PIPELINE STAGE
  • Address Bus Width: 64
  • Bit Size: 64
  • Boundary Scan: NO
  • Clock Frequency-Max: 100 MHz
  • External Data Bus Width: 64
  • Format: FLOATING POINT
  • Integrated Cache: YES
  • JESD-30 Code: S-PBGA-B272
  • JESD-609 Code: e1
  • Length: 29 mm
  • Low Power Mode: YES
  • Number of Terminals: 272
  • Operating Temperature-Max: 85 °C
  • Package Body Material: PLASTIC/EPOXY
  • Package Code: LBGA
  • Package Shape: SQUARE
  • Package Style: GRID ARRAY, LOW PROFILE
  • Peak Reflow Temperature (Cel): 260
  • Qualification Status: Not Qualified
  • Seated Height-Max: 1.7 mm
  • Speed: 200 MHz
  • Supply Voltage-Max: 3.465 V
  • Supply Voltage-Min: 3.135 V
  • Supply Voltage-Nom: 3.3 V
  • Surface Mount: YES
  • Technology: MOS
  • Temperature Grade: OTHER
  • Terminal Finish: TIN SILVER COPPER
  • Terminal Form: BALL
  • Terminal Pitch: 1.27 mm
  • Terminal Position: BOTTOM
  • Time@Peak Reflow Temperature-Max (s): 10
  • Width: 29 mm
  • uPs/uCs/Peripheral ICs Type: MICROPROCESSOR, RISC
  • UPD30500S2-200 CAD Models Information
    • Part Symbol photo
    • Footprint
    • 3D Model
    FAQ (Frequently Asked Questions) for UPD30500S2-200
    • Q:Where can I buy UPD30500S2-200?

      A:We have the UPD30500S2-200 available for sell at the moment, you can contact us by email for the price and delivery time.

    • Q:How do I place an order and pay it?

      A:You can place an order by email, and you can pay by Bank Transfer or Paypal.

    • Q:How long I can receive the shipment after order?

      A:We will ship within 1 day after order, and you will receive it in around 2-3 days.

    • Q:When can I receive a reply after sending email?

      A:We will reply you within 24 hours.

    • Q:How do I use UPD30500S2-200 for my products?

      A:Please refer to the application note.

    • Q:How can I download a datasheet for UPD30500S2-200?

      A:You can download the datasheet on our product page, or you can send us by email to request a datasheet.

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