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Manufacturer / Brand: NXP Semiconductors
Details: 32-BIT, 400MHz, MICROPROCESSOR, PBGA473
HTS Code: 8542.31.00.01
Quantity Available: Over 104410 Pieces

Datasheet for MCIMX27LMOP4AR2:

MCIMX27LMOP4AR2 datasheet
Price for MCIMX27LMOP4AR2
Product Parameters
  • Manufacturer Part Number : MCIMX27LMOP4AR2
  • Manufacturer : NXP Semiconductors
  • Description : 32-BIT, 400MHz, MICROPROCESSOR, PBGA473
  • Reference Price : USD 
  • Our Price : We have a better price, contact us by email
  • Function : -
  • CPU Family: -
  • RAM Type: -
  • Status : Active (In Production)
  • ROHS Status : Rohs Compliant
  • Package Type : -
  • Standard Packing Type : Reel / Tube / Tray / Box
  • Standard Packing Quantity : -
  • Working Temperature : -
  • Other Part Number : MCIMX27LMOP4AR2
  • Shipping methods : DHL FEDEX UPS TNT
  • Delivery Time : Ship within 1 day.
  • Manufacturer Production time : 6-8 weeks (Normally have stocks)
  • Weight : 0.001KG

Contact us to check the best price and real time inventory quantity for MCIMX27LMOP4AR2. If you need any more information about MCIMX27LMOP4AR2, you can also send us by email. Our email is [email protected], we will reply you in 12 hours.

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Detailed Description of MCIMX27LMOP4AR2
  • Manufacturer Part Number: MCIMX27LMOP4AR2
  • Rohs Code: Yes
  • Part Life Cycle Code: Not Recommended
  • Ihs Manufacturer: NXP SEMICONDUCTORS
  • Package Description: 19 X 19 MM, 0.80 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, MAPBGA-473
  • Reach Compliance Code: compliant
  • ECCN Code: 5A992.C
  • HTS Code: 8542.31.00.01
  • Manufacturer: NXP Semiconductors
  • Risk Rank: 5.3
  • Additional Feature: ALSO OPERATES 1.3V AT 266MHZ; UNAVAILABLE FOR IMPORT OR SALE IN US
  • Address Bus Width: 26
  • Bit Size: 32
  • Boundary Scan: YES
  • Clock Frequency-Max: 26 MHz
  • External Data Bus Width: 16
  • Format: FIXED POINT
  • Integrated Cache: YES
  • JESD-30 Code: S-PBGA-B473
  • JESD-609 Code: e1
  • Length: 19 mm
  • Low Power Mode: YES
  • Moisture Sensitivity Level: 3
  • Number of Terminals: 473
  • Operating Temperature-Max: 85 °C
  • Operating Temperature-Min: -40 °C
  • Package Body Material: PLASTIC/EPOXY
  • Package Code: LFBGA
  • Package Shape: SQUARE
  • Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH
  • Peak Reflow Temperature (Cel): 260
  • Seated Height-Max: 1.54 mm
  • Speed: 400 MHz
  • Supply Voltage-Max: 1.52 V
  • Supply Voltage-Min: 1.38 V
  • Supply Voltage-Nom: 1.45 V
  • Surface Mount: YES
  • Technology: CMOS
  • Temperature Grade: INDUSTRIAL
  • Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
  • Terminal Form: BALL
  • Terminal Pitch: 0.8 mm
  • Terminal Position: BOTTOM
  • Time@Peak Reflow Temperature-Max (s): 40
  • Width: 19 mm
  • uPs/uCs/Peripheral ICs Type: MICROPROCESSOR
  • MCIMX27LMOP4AR2 CAD Models Information
    • Part Symbol photo
    • Footprint
    • 3D Model
    FAQ (Frequently Asked Questions) for MCIMX27LMOP4AR2
    • Q:Where can I buy MCIMX27LMOP4AR2?

      A:We have the MCIMX27LMOP4AR2 available for sell at the moment, you can contact us by email for the price and delivery time.

    • Q:How do I place an order and pay it?

      A:You can place an order by email, and you can pay by Bank Transfer or Paypal.

    • Q:How long I can receive the shipment after order?

      A:We will ship within 1 day after order, and you will receive it in around 2-3 days.

    • Q:When can I receive a reply after sending email?

      A:We will reply you within 24 hours.

    • Q:How do I use MCIMX27LMOP4AR2 for my products?

      A:Please refer to the application note.

    • Q:How can I download a datasheet for MCIMX27LMOP4AR2?

      A:You can download the datasheet on our product page, or you can send us by email to request a datasheet.

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