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Manufacturer / Brand: NXP Semiconductors
Details: SPECIALTY MICROPROCESSOR CIRCUIT, PBGA529
HTS Code: 8542.31.00.01
Quantity Available: Over 146960 Pieces

Datasheet for MCIMX535DVV1C:

MCIMX535DVV1C datasheet
Price for MCIMX535DVV1C
Product Parameters
  • Manufacturer Part Number : MCIMX535DVV1C
  • Manufacturer : NXP Semiconductors
  • Description : SPECIALTY MICROPROCESSOR CIRCUIT, PBGA529
  • Reference Price : USD 42.8967
  • Our Price : We have a better price, contact us by email
  • Function : -
  • CPU Family: -
  • RAM Type: -
  • Status : Active (In Production)
  • ROHS Status : Rohs Compliant
  • Package Type : -
  • Standard Packing Type : Reel / Tube / Tray / Box
  • Standard Packing Quantity : -
  • Working Temperature : -
  • Other Part Number : MCIMX535DVV1C
  • Shipping methods : DHL FEDEX UPS TNT
  • Delivery Time : Ship within 1 day.
  • Manufacturer Production time : 6-8 weeks (Normally have stocks)
  • Weight : 0.001KG

Contact us to check the best price and real time inventory quantity for MCIMX535DVV1C. If you need any more information about MCIMX535DVV1C, you can also send us by email. Our email is [email protected], we will reply you in 12 hours.

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Detailed Description of MCIMX535DVV1C
  • Manufacturer Part Number: MCIMX535DVV1C
  • Rohs Code: Yes
  • Part Life Cycle Code: Active
  • Ihs Manufacturer: NXP SEMICONDUCTORS
  • Package Description: TEPBGA-529
  • Reach Compliance Code: compliant
  • ECCN Code: 5A992
  • HTS Code: 8542.31.00.01
  • Manufacturer: NXP Semiconductors
  • Risk Rank: 1.83
  • Address Bus Width: 16
  • Boundary Scan: YES
  • Bus Compatibility: ETHERNET; I2C; I2S; IRDA; RS-232; SPI; UART; USB
  • Clock Frequency-Max: 27 MHz
  • External Data Bus Width: 32
  • JESD-30 Code: S-PBGA-B529
  • JESD-609 Code: e2
  • Length: 19 mm
  • Moisture Sensitivity Level: 3
  • Number of I/O Lines: 19
  • Number of Terminals: 529
  • Operating Temperature-Max: 85 °C
  • Operating Temperature-Min: -20 °C
  • Package Body Material: PLASTIC/EPOXY
  • Package Code: FBGA
  • Package Equivalence Code: BGA529,23X23,32
  • Package Shape: SQUARE
  • Package Style: GRID ARRAY, FINE PITCH
  • Peak Reflow Temperature (Cel): 260
  • Power Supplies: 0.9/1.25,1.3 V
  • Qualification Status: Not Qualified
  • RAM (words): 73728
  • Seated Height-Max: 1.85 mm
  • Subcategory: Graphics Processors
  • Supply Voltage-Max: 1.4 V
  • Supply Voltage-Min: 1.2 V
  • Supply Voltage-Nom: 1.25 V
  • Surface Mount: YES
  • Technology: CMOS
  • Temperature Grade: OTHER
  • Terminal Finish: TIN COPPER/TIN SILVER
  • Terminal Form: BALL
  • Terminal Pitch: 0.8 mm
  • Terminal Position: BOTTOM
  • Time@Peak Reflow Temperature-Max (s): 40
  • Width: 19 mm
  • uPs/uCs/Peripheral ICs Type: MICROPROCESSOR CIRCUIT
  • MCIMX535DVV1C CAD Models Information
    • Part Symbol photo
    • Footprint
    • 3D Model
    FAQ (Frequently Asked Questions) for MCIMX535DVV1C
    • Q:Where can I buy MCIMX535DVV1C?

      A:We have the MCIMX535DVV1C available for sell at the moment, you can contact us by email for the price and delivery time.

    • Q:How do I place an order and pay it?

      A:You can place an order by email, and you can pay by Bank Transfer or Paypal.

    • Q:How long I can receive the shipment after order?

      A:We will ship within 1 day after order, and you will receive it in around 2-3 days.

    • Q:When can I receive a reply after sending email?

      A:We will reply you within 24 hours.

    • Q:How do I use MCIMX535DVV1C for my products?

      A:Please refer to the application note.

    • Q:How can I download a datasheet for MCIMX535DVV1C?

      A:You can download the datasheet on our product page, or you can send us by email to request a datasheet.

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