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Manufacturer / Brand: Intel Corporation
Details: RISC Microprocessor, CMOS, PBGA544, LEAD FREE, PLASTIC, BGA-544
HTS Code: 8542.31.00.01
Quantity Available: Over 120220 Pieces

Datasheet for EWIXP460BAD:

EWIXP460BAD datasheet
Price for EWIXP460BAD
Product Parameters
  • Manufacturer Part Number : EWIXP460BAD
  • Manufacturer : Intel Corporation
  • Description : RISC Microprocessor, CMOS, PBGA544, LEAD FREE, PLASTIC, BGA-544
  • Reference Price : USD 38.93
  • Our Price : We have a better price, contact us by email
  • Function : -
  • CPU Family: -
  • RAM Type: -
  • Status : Active (In Production)
  • ROHS Status : Rohs Compliant
  • Package Type : -
  • Standard Packing Type : Reel / Tube / Tray / Box
  • Standard Packing Quantity : -
  • Working Temperature : -
  • Other Part Number : EWIXP460BAD
  • Shipping methods : DHL FEDEX UPS TNT
  • Delivery Time : Ship within 1 day.
  • Manufacturer Production time : 6-8 weeks (Normally have stocks)
  • Weight : 0.001KG

Contact us to check the best price and real time inventory quantity for EWIXP460BAD. If you need any more information about EWIXP460BAD, you can also send us by email. Our email is [email protected], we will reply you in 12 hours.

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Detailed Description of EWIXP460BAD
  • Manufacturer Part Number: EWIXP460BAD
  • Pbfree Code: Yes
  • Rohs Code: Yes
  • Part Life Cycle Code: Obsolete
  • Ihs Manufacturer: INTEL CORP
  • Part Package Code: BGA
  • Package Description: TBGA, BGA544,26X26,50
  • Pin Count: 544
  • Reach Compliance Code: compliant
  • ECCN Code: 3A991.A.2
  • HTS Code: 8542.31.00.01
  • Manufacturer: Intel Corporation
  • Risk Rank: 5.79
  • Address Bus Width: 32
  • Bit Size: 32
  • Boundary Scan: YES
  • Clock Frequency-Max: 33.33 MHz
  • External Data Bus Width: 32
  • Format: FIXED POINT
  • Integrated Cache: YES
  • JESD-30 Code: S-PBGA-B544
  • JESD-609 Code: e1
  • Length: 35 mm
  • Low Power Mode: YES
  • Number of Terminals: 544
  • Operating Temperature-Max: 70 °C
  • Package Body Material: PLASTIC/EPOXY
  • Package Code: TBGA
  • Package Equivalence Code: BGA544,26X26,50
  • Package Shape: SQUARE
  • Package Style: GRID ARRAY, THIN PROFILE
  • Peak Reflow Temperature (Cel): 260
  • Power Supplies: 1.3,3.3 V
  • Qualification Status: Not Qualified
  • Seated Height-Max: 1.17 mm
  • Speed: 533 MHz
  • Subcategory: Microprocessors
  • Supply Voltage-Max: 3.465 V
  • Supply Voltage-Min: 3.135 V
  • Supply Voltage-Nom: 3.3 V
  • Surface Mount: YES
  • Technology: CMOS
  • Temperature Grade: COMMERCIAL
  • Terminal Finish: TIN SILVER COPPER
  • Terminal Form: BALL
  • Terminal Pitch: 1.27 mm
  • Terminal Position: BOTTOM
  • Time@Peak Reflow Temperature-Max (s): 40
  • Width: 35 mm
  • uPs/uCs/Peripheral ICs Type: MICROPROCESSOR, RISC
  • EWIXP460BAD CAD Models Information
    • Part Symbol photo
    • Footprint
    • 3D Model
    FAQ (Frequently Asked Questions) for EWIXP460BAD
    • Q:Where can I buy EWIXP460BAD?

      A:We have the EWIXP460BAD available for sell at the moment, you can contact us by email for the price and delivery time.

    • Q:How do I place an order and pay it?

      A:You can place an order by email, and you can pay by Bank Transfer or Paypal.

    • Q:How long I can receive the shipment after order?

      A:We will ship within 1 day after order, and you will receive it in around 2-3 days.

    • Q:When can I receive a reply after sending email?

      A:We will reply you within 24 hours.

    • Q:How do I use EWIXP460BAD for my products?

      A:Please refer to the application note.

    • Q:How can I download a datasheet for EWIXP460BAD?

      A:You can download the datasheet on our product page, or you can send us by email to request a datasheet.

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