SM32DM355GCEM216EP Enhanced Product Digital Media DM355 Processor 337-NFBGA -55 to 125

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SM32DM355GCEM216EP

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Manufacturer / Brand: Texas Instruments

Details: Enhanced Product Digital Media DM355 Processor 337-NFBGA -55 to 125

HTS Code: 8542.31.00.01

Quantity Available: Over 141890 Pieces

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Datasheet for SM32DM355GCEM216EP:

Product Parameters

Manufacturer Part Number : SM32DM355GCEM216EP
Manufacturer : Texas Instruments
Description : Enhanced Product Digital Media DM355 Processor 337-NFBGA -55 to 125
Reference Price : USD 47.81
Our Price : We have a better price, contact us by email
Function : -
CPU Family: -
RAM Type: -
Status : Active (In Production)
ROHS Status : Rohs Compliant
Package Type : -
Standard Packing Type : Reel / Tube / Tray / Box
Standard Packing Quantity : -
Working Temperature : -
Other Part Number : SM32DM355GCEM216EP
Shipping methods : DHL FEDEX UPS TNT
Delivery Time : Ship within 1 day.
Manufacturer Production time : 6-8 weeks (Normally have stocks)
Weight : 0.001KG

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Detailed Description of SM32DM355GCEM216EP

Manufacturer Part Number: SM32DM355GCEM216EP

Brand Name: Texas Instruments

Part Life Cycle Code: Active

Ihs Manufacturer: TEXAS INSTRUMENTS INC

Part Package Code: BGA

Package Description: PLASTIC, NFBGA-337

Pin Count: 337

Reach Compliance Code: not_compliant

ECCN Code: 3A001A2C

Manufacturer: Texas Instruments

Risk Rank: 1.41

Bit Size: 32

Bus Compatibility: I2C; SPI; UART; USB

External Data Bus Width: 32

Format: FIXED POINT

JESD-30 Code: S-PBGA-B337

JESD-609 Code: e0

Length: 13 mm

Moisture Sensitivity Level: 3

Number of Terminals: 337

Operating Temperature-Max: 125 °C

Operating Temperature-Min: -55 °C

Package Body Material: PLASTIC/EPOXY

Package Code: LFBGA

Package Equivalence Code: BGA337,19X19,25

Package Shape: SQUARE

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

Power Supplies: 1.3,1.8,3.3 V

RAM (words): 8192

Seated Height-Max: 1.3 mm

Subcategory: Digital Signal Processors

Supply Voltage-Max: 1.365 V

Supply Voltage-Min: 1.235 V

Supply Voltage-Nom: 1.3 V

Surface Mount: YES

Technology: CMOS

Temperature Grade: MILITARY

Terminal Finish: Tin/Lead (Sn/Pb)

Terminal Form: BALL

Terminal Pitch: 0.65 mm

Terminal Position: BOTTOM

Width: 13 mm

uPs/uCs/Peripheral ICs Type: MICROPROCESSOR CIRCUIT

SM32DM355GCEM216EP CAD Models Information

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FAQ (Frequently Asked Questions) for SM32DM355GCEM216EP

Q:Where can I buy SM32DM355GCEM216EP?
A:We have the SM32DM355GCEM216EP available for sell at the moment, you can contact us by email for the price and delivery time.
Q:How do I place an order and pay it?
A:You can place an order by email, and you can pay by Bank Transfer or Paypal.
Q:How long I can receive the shipment after order?
A:We will ship within 1 day after order, and you will receive it in around 2-3 days.
Q:When can I receive a reply after sending email?
A:We will reply you within 24 hours.
Q:How do I use SM32DM355GCEM216EP for my products?
A:Please refer to the application note.
Q:How can I download a datasheet for SM32DM355GCEM216EP?
A:You can download the datasheet on our product page, or you can send us by email to request a datasheet.

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Datasheet for SM32DM355GCEM216EP:

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