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Manufacturer / Brand: Texas Instruments
Details: SPECIALTY MICROPROCESSOR CIRCUIT, PBGA337, 13 X 13 MM, 0.65 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-337
HTS Code: 8542.31.00.01
Quantity Available: Over 98120 Pieces

Datasheet for TMS320DM355ZCE270:

TMS320DM355ZCE270 datasheet
Price for TMS320DM355ZCE270
Product Parameters
  • Manufacturer Part Number : TMS320DM355ZCE270
  • Manufacturer : Texas Instruments
  • Description : SPECIALTY MICROPROCESSOR CIRCUIT, PBGA337, 13 X 13 MM, 0.65 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-337
  • Reference Price : USD 25.04
  • Our Price : We have a better price, contact us by email
  • Function : -
  • CPU Family: -
  • RAM Type: -
  • Status : Active (In Production)
  • ROHS Status : Rohs Compliant
  • Package Type : -
  • Standard Packing Type : Reel / Tube / Tray / Box
  • Standard Packing Quantity : -
  • Working Temperature : -
  • Other Part Number : TMS320DM355ZCE270
  • Shipping methods : DHL FEDEX UPS TNT
  • Delivery Time : Ship within 1 day.
  • Manufacturer Production time : 6-8 weeks (Normally have stocks)
  • Weight : 0.001KG

Contact us to check the best price and real time inventory quantity for TMS320DM355ZCE270. If you need any more information about TMS320DM355ZCE270, you can also send us by email. Our email is [email protected], we will reply you in 12 hours.

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Detailed Description of TMS320DM355ZCE270
  • Manufacturer Part Number: TMS320DM355ZCE270
  • Pbfree Code: Yes
  • Rohs Code: Yes
  • Part Life Cycle Code: Not Recommended
  • Ihs Manufacturer: TEXAS INSTRUMENTS INC
  • Part Package Code: BGA
  • Package Description: 13 X 13 MM, 0.65 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-337
  • Pin Count: 337
  • Reach Compliance Code: unknown
  • HTS Code: 8542.31.00.01
  • Factory Lead Time: 1 Week
  • Manufacturer: Texas Instruments
  • Risk Rank: 8.36
  • Bit Size: 32
  • Format: FIXED POINT
  • JESD-30 Code: S-PBGA-B337
  • JESD-609 Code: e1
  • Length: 13 mm
  • Moisture Sensitivity Level: 3
  • Number of Terminals: 337
  • Operating Temperature-Max: 85 °C
  • Package Body Material: PLASTIC/EPOXY
  • Package Code: LFBGA
  • Package Equivalence Code: BGA337,19X19,25
  • Package Shape: SQUARE
  • Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH
  • Peak Reflow Temperature (Cel): 260
  • Power Supplies: 1.3,1.8,3.3 V
  • Qualification Status: Not Qualified
  • RAM (words): 32768
  • Seated Height-Max: 1.3 mm
  • Subcategory: Digital Signal Processors
  • Supply Voltage-Max: 1.365 V
  • Supply Voltage-Min: 1.235 V
  • Supply Voltage-Nom: 1.3 V
  • Surface Mount: YES
  • Technology: CMOS
  • Temperature Grade: OTHER
  • Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
  • Terminal Form: BALL
  • Terminal Pitch: 0.65 mm
  • Terminal Position: BOTTOM
  • Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
  • Width: 13 mm
  • uPs/uCs/Peripheral ICs Type: MICROPROCESSOR CIRCUIT
  • TMS320DM355ZCE270 CAD Models Information
    • Part Symbol photo
    • Footprint
    • 3D Model
    FAQ (Frequently Asked Questions) for TMS320DM355ZCE270
    • Q:Where can I buy TMS320DM355ZCE270?

      A:We have the TMS320DM355ZCE270 available for sell at the moment, you can contact us by email for the price and delivery time.

    • Q:How do I place an order and pay it?

      A:You can place an order by email, and you can pay by Bank Transfer or Paypal.

    • Q:How long I can receive the shipment after order?

      A:We will ship within 1 day after order, and you will receive it in around 2-3 days.

    • Q:When can I receive a reply after sending email?

      A:We will reply you within 24 hours.

    • Q:How do I use TMS320DM355ZCE270 for my products?

      A:Please refer to the application note.

    • Q:How can I download a datasheet for TMS320DM355ZCE270?

      A:You can download the datasheet on our product page, or you can send us by email to request a datasheet.

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