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Manufacturer / Brand: ROHM Semiconductor
Details: Parallel I/O Port, 8-Bit, 8 I/O, CMOS, 3 X 3 MM, ROHS COMPLIANT, VQFN-16
HTS Code: 8542.39.00.01
Quantity Available: Over 92720 Pieces

Datasheet for BU1850MUV-E2:

BU1850MUV-E2 datasheet
Price for BU1850MUV-E2
Product Parameters
  • Manufacturer Part Number : BU1850MUV-E2
  • Manufacturer : ROHM Semiconductor
  • Description : Parallel I/O Port, 8-Bit, 8 I/O, CMOS, 3 X 3 MM, ROHS COMPLIANT, VQFN-16
  • Reference Price : USD 1.39
  • Our Price : We have a better price, contact us by email
  • Function : -
  • CPU Family: -
  • RAM Type: -
  • Status : Active (In Production)
  • ROHS Status : Rohs Compliant
  • Package Type : -
  • Standard Packing Type : Reel / Tube / Tray / Box
  • Standard Packing Quantity : -
  • Working Temperature : -
  • Other Part Number : BU1850MUV-E2
  • Shipping methods : DHL FEDEX UPS TNT
  • Delivery Time : Ship within 1 day.
  • Manufacturer Production time : 6-8 weeks (Normally have stocks)
  • Weight : 0.001KG

Contact us to check the best price and real time inventory quantity for BU1850MUV-E2. If you need any more information about BU1850MUV-E2, you can also send us by email. Our email is [email protected], we will reply you in 12 hours.

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Detailed Description of BU1850MUV-E2
  • Manufacturer Part Number: BU1850MUV-E2
  • Pbfree Code: Yes
  • Rohs Code: Yes
  • Part Life Cycle Code: Not Recommended
  • Ihs Manufacturer: ROHM CO LTD
  • Part Package Code: QFN
  • Package Description: 3 X 3 MM, ROHS COMPLIANT, VQFN-16
  • Pin Count: 16
  • Reach Compliance Code: compliant
  • ECCN Code: EAR99
  • HTS Code: 8542.39.00.01
  • Manufacturer: ROHM Semiconductor
  • Risk Rank: 7.96
  • JESD-30 Code: S-XQCC-N16
  • JESD-609 Code: e3/e2
  • Length: 3 mm
  • Number of Bits: 8
  • Number of I/O Lines: 8
  • Number of Ports: 0
  • Number of Terminals: 16
  • Operating Temperature-Max: 85 °C
  • Operating Temperature-Min: -30 °C
  • Package Body Material: UNSPECIFIED
  • Package Code: HVQCCN
  • Package Equivalence Code: LCC16,.12SQ,20
  • Package Shape: SQUARE
  • Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
  • Peak Reflow Temperature (Cel): 260
  • Power Supplies: 1.8 V
  • Qualification Status: Not Qualified
  • Seated Height-Max: 1 mm
  • Subcategory: Parallel IO Port
  • Supply Voltage-Max: 3.6 V
  • Supply Voltage-Min: 1.65 V
  • Supply Voltage-Nom: 1.8 V
  • Surface Mount: YES
  • Technology: CMOS
  • Temperature Grade: OTHER
  • Terminal Finish: TIN/TIN COPPER
  • Terminal Form: NO LEAD
  • Terminal Pitch: 0.5 mm
  • Terminal Position: QUAD
  • Time@Peak Reflow Temperature-Max (s): 10
  • Width: 3 mm
  • uPs/uCs/Peripheral ICs Type: PARALLEL IO PORT, GENERAL PURPOSE
  • BU1850MUV-E2 CAD Models Information
    • Part Symbol photo
    • Footprint
    • 3D Model
    FAQ (Frequently Asked Questions) for BU1850MUV-E2
    • Q:Where can I buy BU1850MUV-E2?

      A:We have the BU1850MUV-E2 available for sell at the moment, you can contact us by email for the price and delivery time.

    • Q:How do I place an order and pay it?

      A:You can place an order by email, and you can pay by Bank Transfer or Paypal.

    • Q:How long I can receive the shipment after order?

      A:We will ship within 1 day after order, and you will receive it in around 2-3 days.

    • Q:When can I receive a reply after sending email?

      A:We will reply you within 24 hours.

    • Q:How do I use BU1850MUV-E2 for my products?

      A:Please refer to the application note.

    • Q:How can I download a datasheet for BU1850MUV-E2?

      A:You can download the datasheet on our product page, or you can send us by email to request a datasheet.

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