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Manufacturer / Brand: NXP Semiconductors
Details: 10Mbps, SERIAL COMM CONTROLLER, PBGA357
HTS Code: 8542.31.00.01
Quantity Available: Over 114850 Pieces

Datasheet for MC68MH360VR25VL:

MC68MH360VR25VL datasheet
Price for MC68MH360VR25VL
Product Parameters
  • Manufacturer Part Number : MC68MH360VR25VL
  • Manufacturer : NXP Semiconductors
  • Description : 10Mbps, SERIAL COMM CONTROLLER, PBGA357
  • Reference Price : USD 
  • Our Price : We have a better price, contact us by email
  • Function : -
  • CPU Family: -
  • RAM Type: -
  • Status : Active (In Production)
  • ROHS Status : Rohs Compliant
  • Package Type : -
  • Standard Packing Type : Reel / Tube / Tray / Box
  • Standard Packing Quantity : -
  • Working Temperature : -
  • Other Part Number : MC68MH360VR25VL
  • Shipping methods : DHL FEDEX UPS TNT
  • Delivery Time : Ship within 1 day.
  • Manufacturer Production time : 6-8 weeks (Normally have stocks)
  • Weight : 0.001KG

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Detailed Description of MC68MH360VR25VL
  • Manufacturer Part Number: MC68MH360VR25VL
  • Rohs Code: Yes
  • Part Life Cycle Code: Obsolete
  • Ihs Manufacturer: NXP SEMICONDUCTORS
  • Package Description: 1.27 MM PITCH, PLASTIC, BGA-357
  • Reach Compliance Code: compliant
  • ECCN Code: 3A991.A.2
  • HTS Code: 8542.31.00.01
  • Manufacturer: NXP Semiconductors
  • Risk Rank: 5.7
  • Additional Feature: ALSO OPERATES AT 3.3 V
  • Address Bus Width: 32
  • Boundary Scan: YES
  • Bus Compatibility: MC68040; MC68030
  • Clock Frequency-Max: 25 MHz
  • Communication Protocol: BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP
  • Data Encoding/Decoding Method: NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL
  • Data Transfer Rate-Max: 1.25 MBps
  • External Data Bus Width: 32
  • JESD-30 Code: S-PBGA-B357
  • JESD-609 Code: e1
  • Length: 25 mm
  • Low Power Mode: YES
  • Moisture Sensitivity Level: 3
  • Number of Terminals: 357
  • Operating Temperature-Max: 70 °C
  • Package Body Material: PLASTIC/EPOXY
  • Package Code: BGA
  • Package Shape: SQUARE
  • Package Style: GRID ARRAY
  • Peak Reflow Temperature (Cel): 260
  • Seated Height-Max: 1.86 mm
  • Supply Voltage-Max: 5.25 V
  • Supply Voltage-Min: 4.75 V
  • Supply Voltage-Nom: 5 V
  • Surface Mount: YES
  • Technology: CMOS
  • Temperature Grade: COMMERCIAL
  • Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
  • Terminal Form: BALL
  • Terminal Pitch: 1.27 mm
  • Terminal Position: BOTTOM
  • Time@Peak Reflow Temperature-Max (s): 40
  • Width: 25 mm
  • uPs/uCs/Peripheral ICs Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
  • MC68MH360VR25VL CAD Models Information
    • Part Symbol photo
    • Footprint
    • 3D Model
    FAQ (Frequently Asked Questions) for MC68MH360VR25VL
    • Q:Where can I buy MC68MH360VR25VL?

      A:We have the MC68MH360VR25VL available for sell at the moment, you can contact us by email for the price and delivery time.

    • Q:How do I place an order and pay it?

      A:You can place an order by email, and you can pay by Bank Transfer or Paypal.

    • Q:How long I can receive the shipment after order?

      A:We will ship within 1 day after order, and you will receive it in around 2-3 days.

    • Q:When can I receive a reply after sending email?

      A:We will reply you within 24 hours.

    • Q:How do I use MC68MH360VR25VL for my products?

      A:Please refer to the application note.

    • Q:How can I download a datasheet for MC68MH360VR25VL?

      A:You can download the datasheet on our product page, or you can send us by email to request a datasheet.

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