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Manufacturer / Brand: NXP Semiconductors
Details: 10Mbps, SERIAL COMM CONTROLLER, PBGA357
HTS Code: 8542.31.00.01
Quantity Available: Over 114850 Pieces
Datasheet for MC68MH360VR25VL:
Product Parameters
- Manufacturer Part Number : MC68MH360VR25VL
- Manufacturer : NXP Semiconductors
- Description : 10Mbps, SERIAL COMM CONTROLLER, PBGA357
- Reference Price : USD
- Our Price : We have a better price, contact us by email
- Function : -
- CPU Family: -
- RAM Type: -
- Status : Active (In Production)
- ROHS Status : Rohs Compliant
- Package Type : -
- Standard Packing Type : Reel / Tube / Tray / Box
- Standard Packing Quantity : -
- Working Temperature : -
- Other Part Number : MC68MH360VR25VL
- Shipping methods : DHL FEDEX UPS TNT
- Delivery Time : Ship within 1 day.
- Manufacturer Production time : 6-8 weeks (Normally have stocks)
- Weight : 0.001KG
Contact us to check the best price and real time inventory quantity for MC68MH360VR25VL. If you need any more information about MC68MH360VR25VL, you can also send us by email. Our email is [email protected], we will reply you in 12 hours.
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Detailed Description of MC68MH360VR25VL
Manufacturer Part Number: MC68MH360VR25VLRohs Code: YesPart Life Cycle Code: ObsoleteIhs Manufacturer: NXP SEMICONDUCTORSPackage Description: 1.27 MM PITCH, PLASTIC, BGA-357Reach Compliance Code: compliantECCN Code: 3A991.A.2HTS Code: 8542.31.00.01Manufacturer: NXP SemiconductorsRisk Rank: 5.7Additional Feature: ALSO OPERATES AT 3.3 VAddress Bus Width: 32Boundary Scan: YESBus Compatibility: MC68040; MC68030Clock Frequency-Max: 25 MHzCommunication Protocol: BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMPData Encoding/Decoding Method: NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVELData Transfer Rate-Max: 1.25 MBpsExternal Data Bus Width: 32JESD-30 Code: S-PBGA-B357JESD-609 Code: e1Length: 25 mmLow Power Mode: YESMoisture Sensitivity Level: 3Number of Terminals: 357Operating Temperature-Max: 70 °CPackage Body Material: PLASTIC/EPOXYPackage Code: BGAPackage Shape: SQUAREPackage Style: GRID ARRAYPeak Reflow Temperature (Cel): 260Seated Height-Max: 1.86 mmSupply Voltage-Max: 5.25 VSupply Voltage-Min: 4.75 VSupply Voltage-Nom: 5 VSurface Mount: YESTechnology: CMOSTemperature Grade: COMMERCIALTerminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)Terminal Form: BALLTerminal Pitch: 1.27 mmTerminal Position: BOTTOMTime@Peak Reflow Temperature-Max (s): 40Width: 25 mmuPs/uCs/Peripheral ICs Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
MC68MH360VR25VL CAD Models Information
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3D Model
FAQ (Frequently Asked Questions) for MC68MH360VR25VL
Q:Where can I buy MC68MH360VR25VL?
A:We have the MC68MH360VR25VL available for sell at the moment, you can contact us by email for the price and delivery time.
Q:How do I place an order and pay it?
A:You can place an order by email, and you can pay by Bank Transfer or Paypal.
Q:How long I can receive the shipment after order?
A:We will ship within 1 day after order, and you will receive it in around 2-3 days.
Q:When can I receive a reply after sending email?
A:We will reply you within 24 hours.
Q:How do I use MC68MH360VR25VL for my products?
A:Please refer to the application note.
Q:How can I download a datasheet for MC68MH360VR25VL?
A:You can download the datasheet on our product page, or you can send us by email to request a datasheet.
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